Systems-in-foil - Devices, fabrication processes and reliability issues

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1123-1128

  van den Brand, J ^a   de Baets, J ^b   van Mol, T ^a   Dietzel, A ^a,c  

^a TNO   (Netherlands)

^b IMEC   (Belgium)

^c EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; OPTICAL DESIGN; ORGANIC LIGHT EMITTING DIODES (OLED); RESEARCH; SILICON; TECHNOLOGY; THERMAL SPRAYING; WATER CONSERVATION;

BASE MATERIALS; END PRODUCTS; FABRICATION PROCESSES; NEW CLASS; ORGANIC LIGHT-EMITTING; RESEARCH ACTIVITIES; SI CHIPS;

THERMAL EXPANSION;

EID: 50549083446     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.06.030     Document Type: Article

References (7)

1. Polymer Vision .
2. Stella .
3. Smith D. Compliance packaging, a patient education tool (1989), American Pharmacy NS29
4. Fjelstad J. Flexible circuit technology (2007), BR Publishing Inc.
5. Navigan Consulting Inc., Energy savings potential of solid state lighting in general lighting applications. Available from: http://www.netl.doe.gov/ssl/PDFs/SSL%20Energy%20Savings%20Potential%20Re port%202006%20final4.pdf.
6. Bulle-Lieuwma C.W.T., and Weijer P.vd. 3D-TOFSIMS characterization of black spots in polymer light emitting diodes. Appl Surf Sci 252 (2006) 6597-6600
7. Brand J.vd., Veninga E., Kusters R., Podprocky T., and Dietzel A. Flipchip bonding of Si chip on flexible PEN foil using novel electronic 100 μm pitch fan-out circuitry. Mater Res Soc Sympos Proc 1030 (2008) G05-10-17