Reliability analysis and design for the fine-pitch flip chip BGA packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 4, 2004, Pages 684-693

  Peng, Chih Tang ^a   Liu, Chang Ming ^a   Lin, Ji Cheng ^a   Cheng, Hsien Chie ^a,b   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Accelerated thermal cycling testing; Daisy chain; Finite element modeling; Flip chip BGA; Parametric design; Reliability

Indexed keywords

COMPUTATIONAL GEOMETRY; CONTACT ANGLE; DESIGN FOR TESTABILITY; ELECTRIC RESISTANCE MEASUREMENT; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; RELIABILITY; SOLDERED JOINTS; THERMAL CYCLING;

ACCELERATED THERMAL CYCLING TESTING; BALL GRID ARRAY; DAISY CHAIN CIRCUIT; FINITE ELEMENT MODELING; FLIP CHIP BGA; PARAMETRIC DESIGN; RELIABILITY ANALYSIS;

CHIP SCALE PACKAGES;

EID: 10244239258     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.838867     Document Type: Article

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