Conductive adhesives from low-VOC silver inks for advanced microelectronics applications

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 1, 2011, Pages 69-75

  Datta, S ^a   Keller, K ^a   Schulz, D L ^a   Webster, D C ^a  

^a NORTH DAKOTA STATE UNIVERSITY   (United States)

Author keywords

Bonding experiment; conductive ink; silver particles; thermoplastic ink formulation

Indexed keywords

CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; CONDUCTIVE INK; ELEVATED TEMPERATURE; INK FORMULATION; RESISTANCE VALUES; SILVER PARTICLES; THERMO-MECHANICAL ANALYSIS;

ACRYLIC MONOMERS; BONDING; DIFFERENTIAL SCANNING CALORIMETRY; MICROELECTRONICS; RADIO FREQUENCY IDENTIFICATION (RFID); REINFORCED PLASTICS; SCANNING ELECTRON MICROSCOPY; THERMOGRAVIMETRIC ANALYSIS; VOLATILE ORGANIC COMPOUNDS;

SILVER;

EID: 84859758221     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2101390     Document Type: Article

References (20)

1. L. Li, J. C. Yang, and T. K. Minton, J. Phys. Chem. C, vol. 111, pp. 6763-6771, 2007.
2. V. R. Marinov, Int. Microelectron. Packagi. Soc.-JMEP, vol. 1, no. 4, pp. 261-268, 2004.
3. K. Grennan, A. J. Killard, and M. R. Smyth, Electroanalysis, vol. 13, no. 8-9, pp. 745-750, 2001.
4. D. A. Pardo, G. E. Jabbour, and N. Peyghambarian, Adv. Materials, vol. 12, no. 17, pp. 1249-1252, 2000.
5. S. E. Shaheen, R. Radspinner, N. Peyghambarian, and G. E. Jabbour, Appl. Phys. Lett., vol. 79, no. 18, pp. 2996-2998, 2001.
6. H. Goldberg, R. B. Brown, D. P. Liu, and M. E. Meyerchoff, Sens. Actuators B, vol. 21, pp. 171-183, 1994.
7. A. Ryan and H. Lewis, Robot. Computer-Integr. Manuf., vol. 23, pp. 720-726, 2007.
8. P. V. Nikitin, S. Lam, and K. V. S. Rao, "Low cost silver ink RFID tag antennas," in IEEE Antennas Propag. Soc. Int. Symp., 2005, vol. 2B, no. 3-8, pp. 353-356.
9. K. Vanheusden, K. Kunze, H. Denham, A. Stump, A. Schult, J. Plakio, and T. Kodas, Adv. Microelectron., vol. 29, no. 1, 2002.
10. T. Yamazaki, "Electrically conductive adhesive composition," U.S. Patent 4 696 764, Sep. 29, 1987.
11. F. W. Kulesza and R. H. Estes, "Flip chip technology using electrically conductive polymers and dielectrics," U.S. Patent 5 237 130, Aug. 17, 1993.
12. D. A. Bolon, G. M. Lucas, and R. L. Bartholomew, "Radiation curable inks," U. S. Patent 3 968 056, Jul. 6, 1976.
13. D. A. Bolon, G. M. Lucas, and S. H. U. V. Schroeter, "Radiation curable electrically conductive ink and circuit boards made therewith," U.S. Patent 4 088 801, May 9, 1978.
14. Y. Xiao, "Conductive ink composition," U.S. Patent 6 322 620, Nov. 27, 2001.
15. Y.-S. Yang, "Radiation curable conductive ink and manufacturing method for using the same," U.S. Patent Appl. 20060278853, Dec. 14, 2006.
16. D. C. Webster, S. Datta, and D. L. Schulz, "Conductive ink compositions containing thermoplastics and conductive particles," PCT Int. Appl.
17. S. Datta, S. Nanavati, N. Schuler,R. Sailer,D.Vaselaar,A. Reinholz, D. L. Schulz, D. Wells, and D. C. Webster, "Development of solvent-free UV-curable conductive inks for printed flexible microelectronics," in Radtech e/5 2006 Tech. Proc., Chicago, Il, 2006.
18. S. Datta and D. C. Webster, "Effect of the composition variables on the UV curing behavior of conductive ink formulations," in UV & EB Technol. Expo Conf., Tech. Conf. Proc., Chicago, Il, 2008.
19. R. B. Booth, M. A. Gaynes, R. M. Murcko, V. Puligandla, J. M. Roldan, R. Saraf, and J. M. Zalesinski, "Direct chip attachment with electrically conductive adhesive," U.S. Patent 5 747 101, May 5, 1998.
20. J. Perelaer, A. W. M. de Laat, C. E. Hendriks, and U. S. Schubert, J. Mater. Chem., vol. 18, pp. 3209-3215, 2008.