Next generation system in a package manufacturing by embedded chip technologies

Journal of Microelectronics and Electronic Packaging

Volumn 7, Issue 3, 2010, Pages 131-137

  Boettcher, Lars ^a   Manessis, D ^b   Karaszkiewicz, S ^b   Ostmann, A ^a   Reichl, H ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

3D packaging; Embedded actives and passives; Embedded components; PCB technology; System in package

Indexed keywords

3D PACKAGING; EMBEDDED ACTIVE; EMBEDDED COMPONENTS; PCB TECHNOLOGIES; SYSTEM IN PACKAGE;

COPPER; POLYCHLORINATED BIPHENYLS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 84859764296     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/imaps.261     Document Type: Conference Paper

References (3)

1. L. Boettcher et al., "Integration of active and passive components using chip in polymer technology," SMTA International, 2005.
2. Session T-A-1C. "European projects on embedding of actives and passives," Proceedings of the 16th European Microelectronics and Packaging Conference, 2007.
3. For information on HERMES refer to: http://www.hermes-ect.net/.