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Volumn , Issue , 2009, Pages 607-611

Ultra-thin, flexible electronics

Author keywords

[No Author keywords available]

Indexed keywords

BIOMEDICAL SENSORS; FLEXIBLE ELECTRONICS; FLEXIBLE INTERCONNECTS; LOW PROFILE; SOLDER JOINTS; THIN MULTILAYERS; ULTRA-THIN; WEARABLE ELECTRONICS;

EID: 70349658271     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074075     Document Type: Conference Paper
Times cited : (11)

References (9)
  • 9
    • 0141882973 scopus 로고    scopus 로고
    • Threedimensional interconnect with excellent moisture resistance for low-cost mmics
    • May
    • S. Sugitani, T. Ishii and M. Tokumitsu; "Threedimensional interconnect with excellent moisture resistance for low-cost MMICs;" IEEE Trans. on Advanced Packaging, Vol. 26, No. 2; May 2003; pp. 133-140.
    • (2003) IEEE Trans. on Advanced Packaging , vol.26 , Issue.2 , pp. 133-140
    • Sugitani, S.1    Ishii, T.2    Tokumitsu, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.