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Flip chip package-in-package (fcPiP): A new 3D packaging solution for mobile platforms
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Ultrathin, flexible electronics
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Lake Buena Vista, FL, May 27-28
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B. Holland, R. McPherson, T. Zhang, Z. Hou, R. Dean, R.W. Johnson, L.D. Castillo and A. Moussessian, "Ultrathin, flexible electronics, " 2008 Electronic Components and Technology Conference (ECTC 2008), Lake Buena Vista, FL, May 27-28, 2008.
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2008 Electronic Components and Technology Conference (ECTC 2008)
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Optimization for chip stack in 3-D packaging
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August
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Threedimensional interconnect with excellent moisture resistance for low-cost mmics
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May
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S. Sugitani, T. Ishii and M. Tokumitsu; "Threedimensional interconnect with excellent moisture resistance for low-cost MMICs;" IEEE Trans. on Advanced Packaging, Vol. 26, No. 2; May 2003; pp. 133-140.
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