Embedded chips: Redefine miniaturization: Inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multilayer circuit boards

Printed Circuit Design and Fab

Volumn 26, Issue 7, 2009, Pages 37-39

  Parton, Els ^a   Christiaens, Wim ^b   Vanfleteren, Jan ^b,c  

^a IMEC's Company   (Belgium)

^b GHENT UNIVERSITY   (Belgium)

^c IMEC CMST Group

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EID: 70249136895     PISSN: 19395442     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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