Large-scale integration of semiconductor nanowires for high-performance flexible electronics

ACS Nano

Volumn 6, Issue 3, 2012, Pages 1888-1900

  Liu, Xi ^a   Long, Yun Ze ^a,d   Liao, Lei ^b   Duan, Xiangfeng ^c   Fan, Zhiyong ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b WUHAN UNIVERSITY   (China)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d QINGDAO UNIVERSITY   (China)

Author keywords

assembly techniques; contact printing; flexible electronics; high frequency device; integrated circuitry; monolayer; nanowire; shear force

Indexed keywords

ASSEMBLY TECHNIQUES; CONTACT PRINTING; HIGH FREQUENCY DEVICES; INTEGRATED CIRCUITRY; SHEAR FORCE;

ARTIFICIAL ORGANS; ELECTRONIC PROPERTIES; FLEXIBLE ELECTRONICS; GRAPHENE; MONOLAYERS; RADIO FREQUENCY IDENTIFICATION (RFID); TAPES;

NANOWIRES;

NANOWIRE; PLASTIC;

ELECTRICAL EQUIPMENT; LIGHT RELATED PHENOMENA; PRINTING; REVIEW; SEMICONDUCTOR;

ELECTRICAL EQUIPMENT AND SUPPLIES; NANOWIRES; OPTICAL PROCESSES; PLASTICS; PRINTING; TRANSISTORS, ELECTRONIC;

EID: 84859153476     PISSN: 19360851     EISSN: 1936086X     Source Type: Journal    
DOI: 10.1021/nn204848r     Document Type: Review

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