BCB wafer bonding technologies for wafer-level packaging with an integrated MEMS resonator

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 852-858

  Brault, S ^a   Leroux, X ^a   El Amrani, M ^a   Dufour Gergam, E ^a   Parrain, F ^a   Verjus, F ^b   Schwindenhammer, P ^b   Lan, S ^a   Bosseboeuf, A ^a  

^a UNIVERSITÉ PARIS SACLAY   (France)

^b PHILIPS RESEARCH LABORATORIES   (Germany)

Author keywords

Adhesive bonding; MEMS; SOL and resonator; Wafer level packaging: BCB

Indexed keywords

ADHESIVE BONDING; BENZO CYCLO BUTENES; FABRICATION COST; FUNCTION OF PRESSURE; MICRO RESONATORS; WAFER LEVEL PACKAGE; WAFER LEVEL PACKAGING; WAFERBONDING TECHNOLOGY;

BUTENES; IMAGE PROCESSING; MEMS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; OPTICAL MICROSCOPY; SEALING (CLOSING); SILICON; SILICON WAFERS; SOLS; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 80053568120     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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