Pirani pressure sensor for smart wafer-level packaging

Sensors and Actuators, A: Physical

Volumn 156, Issue 1, 2009, Pages 201-207

  Mailly, F ^a   Dumas, N ^a   Pous, N ^a   Latorre, L ^a   Garel, O ^b   Martincic, E ^b   Verjus, F ^c   Pellet, C ^d   Dufour Gergam, E ^b   Nouet, P ^a  

^a LIRMM   (France)

^b CNRS   (France)

^c NXP SEMICONDUCTORS   (Netherlands)

^d UNIVERSITÉ DE BORDEAUX   (France)

Author keywords

MEMS; Pressure sensor; Smart packaging; Thermal sensor

Indexed keywords

INTEGRATED CIRCUIT DESIGN; MATLAB; MEMS; MICROELECTROMECHANICAL DEVICES; PRESSURE SENSORS; RESONATORS; SILICON COMPOUNDS; SYSTEM-IN-PACKAGE;

CONDITIONING CIRCUIT; ENVIRONMENTAL SENSOR; MATLAB/SIMULINK MODELING; SMART PACKAGING; SYSTEMS IN PACKAGES; TEMPERATURE CONSTANT; THERMAL SENSORS; WAFER LEVEL PACKAGING;

PACKAGING;

EID: 71949101842     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2009.02.013     Document Type: Article

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