Pirani vacuum gauges using silicon-on-glass and dissolved-wafer processes for the characterization of MEMS vacuum packaging

IEEE Sensors Journal

Volumn 9, Issue 3, 2009, Pages 263-270

  Topalli, Ebru Sagiroglu ^a,b   Topalli, Kagan ^a   Alper, Said Emre ^a   Serin, Tulay ^b   Akin, Tayfun ^a  

^a MIDDLE EAST TECHNICAL UNIVERSITY   (Turkey)

^b ANKARA UNIVERSITY   (Turkey)

Author keywords

Microelectromechanical systems (MEMS); Packaging; Pirani gauge; Pressure sensor; Vacuum

Indexed keywords

CLOSE PROXIMITY; DYNAMIC RANGE; FABRICATION PROCESS; HYBRID PLATFORM; MEMSDEVICES; MICRO-BRIDGE; MICROELECTROMECHANICAL SYSTEMS; MICROELECTROMECHANICAL SYSTEMS (MEMS); PIRANI GAUGE; SILICON ISLANDS; SILICON-ON-GLASS; STRUCTURAL LAYERS; VACUUM GAUGES; VACUUM PACKAGE; VACUUM PACKAGING; WAFER LEVEL;

COMPOSITE MICROMECHANICS; DISSOLUTION; ELECTRONICS PACKAGING; FABRICATION; GLASS; HEAT SINKS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; PRESSURE SENSORS; PRESSURE TRANSDUCERS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; VACUUM; VACUUM GAGES; VACUUM TECHNOLOGY;

GAGES;

EID: 67650318001     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2008.2012200     Document Type: Conference Paper

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