Effect of microscale gaseous thermal conduction on the thermal behavior of a buckled microbridge

Smart Materials and Structures

Volumn 17, Issue 1, 2008, Pages

  Wang, Jiaqi ^a   Tang, Zhenan ^a   Li, Jinfeng ^a   Zhang, Fengtian ^b  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b RESEARCH CENTER OF LASER FUSION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; MICROACTUATORS; MICROSENSORS; POLYSILICON; TEMPERATURE DISTRIBUTION; TEMPERATURE SENSORS; THERMAL CONDUCTIVITY;

MICROBRIDGE BUCKLING; MICROBRIDGES; THERMAL BEHAVIOR; THERMAL MICROSENSORS;

MEMS;

EID: 41849117255     PISSN: 09641726     EISSN: 1361665X     Source Type: Journal    
DOI: 10.1088/0964-1726/17/01/015036     Document Type: Article

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