-
1
-
-
1542333484
-
A new low switching noise CMOS logic circuits for single-chip CMOS imaging system
-
H.H. Chung et al., "A new low switching noise CMOS logic circuits for single-chip CMOS imaging system", Sensors, 2003, pp. 1136-1140.
-
(2003)
Sensors
, pp. 1136-1140
-
-
Chung, H.H.1
-
2
-
-
0034507990
-
Delay uncertainty due to on-chip simultaneous switching noise in high performance CMOS integrated circuits
-
K.T. Tang and E.G. Friedman "Delay uncertainty due to on-chip simultaneous switching noise in high performance CMOS integrated circuits", Workshop on Signal Processing Systems, 2000, pp. 633-642.
-
(2000)
Workshop on Signal Processing Systems
, pp. 633-642
-
-
Tang, K.T.1
Friedman, E.G.2
-
3
-
-
0022117244
-
ΔI noise specification for a high performance computer machine
-
G. Katopis, " ΔI Noise Specification for a High Performance Computer Machine", Proceedings ofthe IEEE, vol.73, no.9, 1985, pp. 1405-1415.
-
(1985)
Proceedings of the IEEE
, vol.73
, Issue.9
, pp. 1405-1415
-
-
Katopis, G.1
-
4
-
-
0030689354
-
Characterizing state devices for switching noise
-
R.F. Hodsoni et al., "Characterizing State Devices for Switching Noise", Southeastcon - Engineering New Century, 1997, pp. 276-277.
-
(1997)
Southeastcon - Engineering New Century
, pp. 276-277
-
-
Hodsoni, R.F.1
-
5
-
-
0032657615
-
Analysis of performance impact caused by power supply noise in deep submicron devices
-
Y.M. Jiang and K.T. Cheng, "Analysis of Performance Impact Caused by Power Supply Noise in Deep Submicron Devices", ACM Design Automation Conference, 1999, pp. 760-765.
-
(1999)
ACM Design Automation Conference
, pp. 760-765
-
-
Jiang, Y.M.1
Cheng, K.T.2
-
6
-
-
0031233443
-
Effects of simultaneous switching noise on the tapered buffer design
-
S.R. Vemuru, "Effects of Simultaneous Switching Noise on the Tapered Buffer Design", IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol.5, no.3, 1997,pp. 290-300.
-
(1997)
IEEE Trans. on Very Large Scale Integration (VLSI) Systems
, vol.5
, Issue.3
, pp. 290-300
-
-
Vemuru, S.R.1
-
9
-
-
0032287523
-
Characterization of flip-chip CMOS ASIC simultaneous switching noise on multilayer organic and ceramic BGA/CGA packages
-
J.P . Libous, "Characterization Of Flip-chip CMOS ASIC Simultaneous Switching Noise On Multilayer Organic And Ceramic BGA/CGA Packages", Meeting on Electrical Performance of Electronic Packaging, 1998, pp. 191-194.
-
(1998)
Meeting on Electrical Performance of Electronic Packaging
, pp. 191-194
-
-
Libous, J.P.1
-
11
-
-
76549103744
-
-
EPIC Design Technology, Inc., Release 3.3
-
RailMill User's Manual, EPIC Design Technology, Inc., Release 3.3, 1995.
-
(1995)
RailMill User's Manual
-
-
-
12
-
-
76549135437
-
Wavelet based nonparametric regression approach for de-noising and modeling of transient switching noise measurements
-
R. Mandrekar and M. Swaminathan, "Wavelet Based Nonparametric Regression Approach for De-noising and Modeling of Transient Switching Noise Measurements", Electronics Packaging Technology Conference, 2003 , pp. 39-44.
-
(2003)
Electronics Packaging Technology Conference
, pp. 39-44
-
-
Mandrekar, R.1
Swaminathan, M.2
-
13
-
-
47949087109
-
A method to measure impedance of chip/package/board power supply system using pseudo-impulse current
-
Y. Zhou et al., "A method to measure impedance of chip/package/board power supply system using pseudo-impulse current", IEEE Elect. Performance of Electronic Packaging, 2006 , pp. 33-36.
-
(2006)
IEEE Elect. Performance of Electronic Packaging
, pp. 33-36
-
-
Zhou, Y.1
-
14
-
-
0033720758
-
On-chip voltage noise monitor for measuring voltage bounce in power supply lines using a digital tester
-
H. Aoki et al., "On-chip voltage noise monitor for measuring voltage bounce in power supply lines using a digital tester", Int. Conf on Microelectronic Test Structures, 2000 , pp. 112-117.
-
(2000)
Int. Conf on Microelectronic Test Structures
, pp. 112-117
-
-
Aoki, H.1
-
15
-
-
11944262768
-
On-die droop detector for analog sensing of power supply noise
-
A. Muhtaroglu et al., "On-die droop detector for ana log sensing of power supply noise", IEEE Journal of Solid-State Circuits, vol.39, no.4, 2004 , pp. 651-660.
-
(2004)
IEEE Journal of Solid-State Circuits
, vol.39
, Issue.4
, pp. 651-660
-
-
Muhtaroglu, A.1
-
16
-
-
0036446210
-
Complete, contactless I/O testing reaching the boundary in minimizing digital IC testing cost
-
S.K. Sunter and B. Nadeau-Dostie, "Complete, contactless I/O testing reaching the boundary in minimizing digital IC testing cost", Int. Test Conf., 2002 , pp. 446-455.
-
(2002)
Int. Test Conf.
, pp. 446-455
-
-
Sunter, S.K.1
Nadeau-Dostie, B.2
-
17
-
-
76549092235
-
On-chip real-time power supply noise detector
-
A. Sehgal et al., "On-chip real-time power supply noise detector", European Solid State Circuits Conf, 2006 ,pp.380-383.
-
(2006)
European Solid State Circuits Conf.
, pp. 380-383
-
-
Sehgal, A.1
-
18
-
-
0031186149
-
Dynamic internal testing of CMOS circuits using hot luminescence
-
J.A. Kash and J.C. Tsang , "Dynamic Internal Testing of CMOS Circuit s Using Hot Luminescence", IEEE Electron Dev. Let., vol.18, no.7, 1997, pp. 330-332.
-
(1997)
IEEE Electron Dev. Let.
, vol.18
, Issue.7
, pp. 330-332
-
-
Kash, J.A.1
Tsang, J.C.2
-
19
-
-
10444255571
-
Timing analysis of a microprocessor PLL using high quantum efficiency superconducting single photon detector (SSPD)
-
P. Song et al., "Timing Analysis of a Microprocessor PLL using High Quantum Efficiency Superconducting Single Photon Detector (SSPD)", Int. Symp. for Testing and Failure Analysis, 2004 , pp. 197-202.
-
(2004)
Int. Symp. for Testing and Failure Analysis
, pp. 197-202
-
-
Song, P.1
-
20
-
-
0344091931
-
Prospects of time-resolved photon emission as a debug tool
-
J. Vickers et al., "Prospects of time-resolved photon emission as a debug tool", Int. Symp. for Testing and Failure Analysis, 2002 , pp. 645-653 .
-
(2002)
Int. Symp. for Testing and Failure Analysis
, pp. 645-653
-
-
Vickers, J.1
-
21
-
-
1542300258
-
Single element time resolved emission probing for practical microprocessor diagnostic applications
-
E.B. Varner et al., "Single element time resolved emission probing for practical microprocessor diagnostic applications", Int. Symp. for Testing and Failure Analysis, 2002 , pp. 741-746.
-
(2002)
Int. Symp. for Testing and Failure Analysis
, pp. 741-746
-
-
Varner, E.B.1
-
22
-
-
1542300263
-
Defect localization using time resolved photon emission on SOI devices that fail scan tests
-
D. Bodoh et al., "Defect Localization Using Time Resolved Photon Emission on SOI Devices That Fail Scan Tests", Int. Symp. for Testing and Failure Analysis, 2002 , pp. 655-661 .
-
(2002)
Int. Symp. for Testing and Failure Analysis
, pp. 655-661
-
-
Bodoh, D.1
-
23
-
-
0344897641
-
Time-resolved photon counting system based on a Geiger-mode InGaAs/lnP APD and a solid immersion lens
-
lS. Vickers et al., "Time-resolved photon counting system based on a Geiger-mode InGaAs/lnP APD and a solid immersion lens", Lasers and Electro-Optics Society, 2003 , pp. 600-601.
-
(2003)
Lasers and Electro-Optics Society
, pp. 600-601
-
-
Vickers, J.S.1
-
24
-
-
0344897647
-
Spectrally- and temporally-resolved dynamic emission from CMOS ICs
-
G.L. Woods and S. Kasapi, "Spectrally- and temporally-resolved dynamic emission from CMOS ICs", Lasers and Electro-Optics Society, 2003 , pp. 598-599.
-
(2003)
Lasers and Electro-Optics Society
, pp. 598-599
-
-
Woods, G.L.1
Kasapi, S.2
-
25
-
-
10444225899
-
Spray cooling for time resolved emission measurements of ICs
-
R.R. Goruganthu et al., "Spray cooling for time resolved emission measurements of ICs", Int. Symp. for Testing and Failure Analysis, 2004 , pp. 18-23.
-
(2004)
Int. Symp. for Testing and Failure Analysis
, pp. 18-23
-
-
Goruganthu, R.R.1
-
26
-
-
10444288970
-
Analysis of 0.13μm CMOS technology using time resolved light emission
-
P. Ouimet et al., "Analysis of 0.13μm CMOS technology using time resolved light emission", Int. Symp. for Testing and Failure Analysis, 2004 , pp. 203-209.
-
(2004)
Int. Symp. for Testing and Failure Analysis
, pp. 203-209
-
-
Ouimet, P.1
-
27
-
-
4544367672
-
PC card based optical probing of advanced graphics processor using time resolved emission
-
H.L. Marks et al., "PC card based optical probing of advanced graphics processor using time resolved emission", Int. Symp. for Testing and Failure Analysis, 2004 , pp. 36-39 .
-
(2004)
Int. Symp. for Testing and Failure Analysis
, pp. 36-39
-
-
Marks, H.L.1
-
28
-
-
63549104342
-
E valuating PICA capability for future low voltage SOI chips
-
F. Stellari et al., "E valuating PICA capability for future low voltage SOI chips", Int. Symp. for Testing and Failure Analysis, 2008 , pp. 407-416.
-
(2008)
Int. Symp. for Testing and Failure Analysis
, pp. 407-416
-
-
Stellari, F.1
-
29
-
-
0035691586
-
High-speed CMOS circuit testing by 50ps time-resolved luminescence measurements
-
F. Stellari et al., "High-speed CMOS circuit testing by 50ps time-resolved luminescence measurement s", Trans. on Electron Dev., vol.48, no.12, 2001, pp. 2830-2835 .
-
(2001)
Trans. on Electron Dev.
, vol.48
, Issue.12
, pp. 2830-2835
-
-
Stellari, F.1
-
30
-
-
33847644903
-
Voltage noise and jitter measurement using time-resolved emission
-
S. Kasapi and G. Woods, "Voltage noise and jitter measurement using time-resolved emission", Int. Symp. on Test and Failure Analysis, 2006 , pp. 438-443 .
-
(2006)
Int. Symp. on Test and Failure Analysis
, pp. 438-443
-
-
Kasapi, S.1
Woods, G.2
-
31
-
-
0035501428
-
Tools for contact less testing and simulation of CMOS circuits
-
F. Stellari et al., "Tools for Contact less Testing and Simulation of CMOS Circuits", Microelectronics Reliability , vol.41, no.11, 2001, pp. 1801-1808.
-
(2001)
Microelectronics Reliability
, vol.41
, Issue.11
, pp. 1801-1808
-
-
Stellari, F.1
-
32
-
-
1542270257
-
Circuit voltage probe based on time-integrated measurements of optical emission from leakage current
-
F. Stellari et al., "Circuit voltage probe based on time-integrated measurements of optical emission from leakage current", Int. Symp. for Testing and Failure Analysis, 2002 , pp. 667-672.
-
(2002)
Int. Symp. for Testing and Failure Analysis
, pp. 667-672
-
-
Stellari, F.1
-
33
-
-
7044274238
-
Off-state luminescence in metal-oxide-semiconductor field -effect transistors and its use as on-chip voltage probe
-
S. Polonsky and AJ. Weger, "Off-state luminescence in metal-oxide-semiconductor field -effect transistors and its use as on-chip voltage probe", Appl. Phys. Lett., vol.85, no.12, 2004, pp. 2390-2392.
-
(2004)
Appl. Phys. Lett.
, vol.85
, Issue.12
, pp. 2390-2392
-
-
Polonsky, S.1
Weger, A.J.2
-
34
-
-
34250753908
-
Local probing of switching noise in VLSI chips using time resolved emission (TRE)
-
F. Stellari et al., "Local probing of switching noise in VLSI chips using Time Resolved Emission (TRE)" , North Atlantic Test Workshop, 2005 , pp. 130-137 .
-
(2005)
North Atlantic Test Workshop
, pp. 130-137
-
-
Stellari, F.1
-
35
-
-
0037508170
-
Picosecond imaging circuit analysis of leakage currents in CMOS circuits
-
S. Polonsky et al., "Picosecond Imaging Circuit Analysis of Leakage Currents in CMOS Circuits ", Int. Symp. for Testing and Failure Analysis, 2002 , pp. 387-390.
-
(2002)
Int. Symp. for Testing and Failure Analysis
, pp. 387-390
-
-
Polonsky, S.1
-
36
-
-
63549104342
-
E valuating PICA capability for future low voltage SOI chips
-
F. Stellari et al., "E valuating PICA capability for future low voltage SOI chip s", Int. Symp. for Testing and Failure Analysis, 2008 , pp. 407-416.
-
(2008)
Int. Symp. for Testing and Failure Analysis
, pp. 407-416
-
-
Stellari, F.1
-
37
-
-
44849092538
-
IBM z6: The next-generation mainframe microprocessor
-
March-April
-
C.F. Webb, " IBM z6: The Next-Generation Mainframe Microprocessor", IEEE Micro, vol.28, no.2, March-April 2008 , pp. 19-29.
-
(2008)
IEEE Micro
, vol.28
, Issue.2
, pp. 19-29
-
-
Webb, C.F.1
-
38
-
-
31344457004
-
Overview of the architecture, circuit design, and physical implementation of a first-generation cell processor
-
D.C. Pham et al., "Overview of the Architecture, Circuit Design, and Physical Implementation of a First-Generation Cell Processor" , IEEE J. Solid-State Circuit, vol.41, no.1, 2006 , pp. 179-196.
-
(2006)
IEEE J. Solid-State Circuit
, vol.41
, Issue.1
, pp. 179-196
-
-
Pham, D.C.1
|