Spray cooling for time resolved emission measurements of ICs

Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004

Volumn , Issue , 2004, Pages 18-23

  Goruganthu, Rama R ^a   Bethke, David ^a   McBride, Shawn ^a   Crawford, Tom ^b   Frank, Jonathan ^b   Cotton, Dan ^b   Cader, Tahir ^c  

^a ADVANCED MICRO DEVICES   (United States)

^b Credence Systems Corporation   (United States)

^c Isothermal Systems Research   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PHOTON TRANSMISSION; SPATIAL RESOLUTION; SPRAY COOLING; TIME RESOLVED EMISSION (TRE) MEASUREMENTS;

COOLANTS; COOLING; COOLING SYSTEMS; DIES; ELECTRIC HEATING ELEMENTS; ELECTRIC POTENTIAL; FLIP CHIP DEVICES; HEAT FLUX; MICROPROCESSOR CHIPS; PROBES; SPRAYING; THERMAL EFFECTS; TRANSISTORS;

INTEGRATED CIRCUITS;

EID: 10444225899     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. Eiles, T.M., and Pardy, P., "Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors," Proc. of ISTFA, 2001, pp. 167-170
3. Ansari, S., et al., "Spray cooling thermal management of a semiconductor chip undergoing probing, diagnostics, and failure analysis," Proc. International Electronic Packaging Technical Conference and Exhibition, 2003.
4. EmiScope is a Registered Trademark of Credence Systems Corporation.
5. Corle, T. R., and Kino, G. S., Confocal Scanning Optical Microscopy and Related Imaging Systems, Academic Press, San Diego, CA, 1996
6. Tummala R.R. et al., Microelectronics Packaging Handbook: Technology Drivers, 2nd Ed., Part 1, Kluwer Academic Publishers (1997), pp. 1-321.
7. Mudawar, I. "Assessment of High-Heat-Flux Thermal Management Schemes," IEEE Trans. Comp. and Pack. Tech., Vol. 24 (2001), pp. 122-141.