Characterization of flip-chip CMOS ASIC simultaneous switching noise on multilayer organic and ceramic BGA/CGA packages

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1998, Pages 191-194

  Libous, J P ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; TIME DOMAIN ANALYSIS;

BALL GRID ARRAYS; COLUMN GRID ARRAYS;

FLIP CHIP DEVICES;

EID: 0032287523     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)