The effects of SAC alloy composition on aging resistance and reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 370-389

  Zhang, Yifei ^a   Cai, Zijie ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a   Bozack, Michael J ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

63SN37PB; ACCELERATED LIFE TESTING; AGING BEHAVIOR; AGING EFFECTS; AGING PHENOMENA; AGING RESISTANCE; AGING TEMPERATURES; AGING TIME; CREEP COMPLIANCE; CREEP PROPERTIES; CREEP TESTS; ELECTRONIC ASSEMBLIES; ELEVATED TEMPERATURE; EUTECTIC SOLDERS; FAILURE BEHAVIORS; FAILURE MODEL; FINITE ELEMENT MODELS; HIGH PERFORMANCE COMPUTING; INDUCED DEGRADATION; ISOTHERMAL AGING; LEAD FREE SOLDERS; LEAD-FREE; LEAD-FREE SOLDER JOINT; LEAD-FREE SOLDER MATERIALS; MATERIAL BEHAVIOR; MECHANICAL BEHAVIOR; MECHANICAL RESPONSE; ROOM TEMPERATURE; SAC ALLOY; SHEAR TESTER; SN-AG-CU; SOLDER ALLOYS; SOLDER BALL SHEAR; SOLDER JOINT RELIABILITY; STRESS-STRAIN; TEST MATRIX; THERMAL CYCLING RELIABILITY; ULTIMATE STRENGTH;

CERIUM; CERIUM COMPOUNDS; CREEP; DEGRADATION; DOPING (ADDITIVES); ELECTRONICS PACKAGING; INTERMETALLICS; MANGANESE; MANGANESE COMPOUNDS; MATERIALS; MECHANICAL PROPERTIES; RELIABILITY; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; STRESSES; TESTING; THERMAL CYCLING; TIN; TIN ALLOYS; YIELD STRESS;

LEAD;

EID: 70349666741     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074043     Document Type: Conference Paper

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