Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder

Materials Science and Engineering: A

Volumn 456, Issue 1-2, 2007, Pages 202-209

  Hsuan, Teng Chun ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Aging; Lead free solder; Microstructure; Solid solution; Tensile strength

Indexed keywords

CRYSTAL MICROSTRUCTURE; EUTECTICS; GRAIN GROWTH; SOLDERING ALLOYS; SOLID SOLUTIONS; TENSILE STRENGTH; THERMAL AGING;

AGE-SOFTENING; LEAD-FREE SOLDER;

TIN ALLOYS;

CRYSTAL MICROSTRUCTURE; EUTECTICS; GRAIN GROWTH; SOLDERING ALLOYS; SOLID SOLUTIONS; TENSILE STRENGTH; THERMAL AGING; TIN ALLOYS;

EID: 33947401089     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.11.144     Document Type: Article

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