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Volumn 410-411, Issue , 2005, Pages 48-52

Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders

(4) Dutta, I a Pan, D a Marks, R A a Jadhav, S G b

a Naval Postgraduate School ^* (United States)

b INTEL CORPORATION (United States)

Author keywords

Coarsening; Creep; Lead free solder; Microstructure

Indexed keywords

AGING OF MATERIALS; CREEP; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; STRAIN RATE; STRESSES; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

COARSENING KINETICS; CREEP MODEL; IN SITU STRAIN-ENHANCED COARSENING; THERMAL AGING TREATMENTS; THERMO-MECHANICAL CYCLING (TMC);

SOLDERING ALLOYS;

CREEP;

EID: 28844489512 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2005.08.142 Document Type: Article

Times cited : (156)

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