Aging induced evolution of free solder material behavior

EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Volumn , Issue , 2008, Pages

  Ma, Hongtao ^a   Zhang, Yifei ^a   Cai, Zijie ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a   Bozack, Michael J ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

63SN-37PB; AGING EFFECTS; CREEP COMPLIANCE; ELECTRONIC PACKAGING; ELEVATED TEMPERATURES; ENVIRONMENTAL EXPOSURES; EUTECTIC SOLDERING; EXPERIMENTAL PROGRAM; GLASS TUBES; HARSH ENVIRONMENTS; HIGH-PRECISION; HIGHER TEMPERATURES; INTERNATIONAL CONFERENCES; ISOTHERMAL AGEING; LEAD-FREE; LEAD-FREE SOLDER JOINTS; LEAD-FREE SOLDERING; MATERIAL BEHAVIORS; MECHANICAL BEHAVIORS; MECHANICAL MEASUREMENTS; MICRO-STRUCTURAL CHANGES; MICRO-SYSTEMS; MULTI-PHYSICS SIMULATION; PHYSICAL AGEING; QUALIFICATION TESTING; RECTANGULAR CROSS SECTIONS; ROOM TEMPERATURES; SAC ALLOYS; SN-AG-CU; SOLDER ALLOYS; SOLDER BALLS; SOLDER JOINTS; SOLDER MATERIAL; TEMPERATURE PROFILING; TEMPERATURE-DEPENDENT; ULTIMATE STRENGTH; UNIAXIAL TESTING; VACUUM SUCTION; VARIATIONS OF; VISCOPLASTIC MATERIALS; WATER QUENCHING;

ALLOYS; BRAZING; COPPER; COPPER ALLOYS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; EXPERIMENTS; LEAD; MECHANICAL ENGINEERING; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; MICROELECTRONICS; OPTICAL DESIGN; QUENCHING; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; SPECIMEN PREPARATION; STRESSES; TEMPERATURE CONTROL; TESTING; THERMAL AGING; THERMAL CYCLING; TIN ALLOYS; TUBES (COMPONENTS); WELDING; YIELD STRESS;

TIN;

EID: 49249104901     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2008.4525093     Document Type: Conference Paper

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