Temperature and strain rate effects on tensile strength and inelastic constitutive relationship of Sn-Pb solders

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 59-66

  Nose, Haruo ^a   Sakane, Masao ^b   Tsukada, Yutaka ^c   Nishimura, Hideo ^c  

^a OSAKA SANGYO UNIVERSITY   (Japan)

^b RITSUMEIKAN UNIVERSITY   (Japan)

^c IBM JAPAN LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; SOLDERING ALLOYS; STRAIN RATE; TENSILE STRENGTH; TENSILE TESTING; THERMAL EFFECTS; TIN ALLOYS; YIELD STRESS;

INELASTIC CONSTITUTIVE RELATIONSHIP; STRESS AMPLITUDE;

ELECTRONICS PACKAGING;

EID: 0344982104     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1533058     Document Type: Article

References (6)

1. Knecht, S., and Fox, L. R., 1990, "Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder," IEEE Trans. Compon., Hybrids, Manuf. Technol., 13(2), pp. 424-433.
2. Skipor, A. F., Harren, S. V., and Botsis, J., 1996, "On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder," ASME JETMT, 118, pp. 1-11.
3. Nose, H., Sakame, M., Tsukada, Y., and Nishimura, H., 1999, "Effect of Temperature and Strain Rate on Mechanical Property of Sn-Pb Solders," Trans. JSME, A-65, pp. 901-908.
4. Yamamoto, T., Sakane, M., Ohnami, M., and Yamada, T., 1995, "Multiaxial Low Cycle Fatigue of 63Sn-37Pb Solder," J. Materials Science Japan, 44(503), pp. 1080-1085.
5. Plumbridge, W., 1998, private communication.
6. Takada, A., Sakane, M., Tsukada, Y., and Nishimura, H., 1998, "Creep and Creep Rupture Property of 63Sn-37Pb and 5Sn-95Pb Solders," Proc., 36th Symposium on Strength of Materials at High Temperatures, Japan Society of Materials Science, pp. 20-24.