Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM

Materials Science and Engineering: A

Volumn 384, Issue 1-2, 2004, Pages 314-323

  Ding, Ying ^a   Wang, Chunqing ^a   Mingyu, Li ^b   Han Sur, Bang ^a,c  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Shenzhen University Town   (China)

^c Chosun University   (South Korea)

Author keywords

63Sn37Pb eutectic solder; Aging; Deformation behavior; In situ SEM; Tensile rate

Indexed keywords

AGING OF MATERIALS; FRACTURE; LEAD; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; STRUCTURAL LOADS; TENSILE TESTING; TIN;

CREEP BEHAVIOR; SOLDER ALLOYS; SURFACE FRAGMENTATION;

EUTECTICS;

AGING; FRACTURE; SOLDER; TENSILE STRESS; TESTING;

EID: 4544252482     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2004.06.030     Document Type: Article

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