A strain rate ratio approach for assessing creep-fatigue life of 63Sn-37Pb solder under shear loading

Journal of Electronic Packaging

Volumn 127, Issue 4, 2005, Pages 407-414

  Tsukada, Yutaka ^a   Nishlmura, Hideo ^b   Yamamoto, Hiroki ^c   Sakane, Masao ^c  

^a KYOCERA CORPORATION   (Japan)

^b IBM JAPAN LTD   (Japan)

^c RITSUMEIKAN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FATIGUE OF MATERIALS; STRAIN RATE;

CREEP-FATIGUE LIFE; SHEAR LOADING; STRAIN RATE RATIO;

SOLDERING ALLOYS;

EID: 29544432309     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2070091     Document Type: Article

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