Aging and creep behavior of Sn3.9Ag0.6Cu solder alloy

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1325-1332

  Xiao, Qiang ^a   Nguyen, Luu ^b   Armstrong, William D ^a  

^a UNIVERSITY OF WYOMING   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP RESISTANCE; LEAD FREE SOLDER ALLOYS; MICROPROBE ANALYSIS; ROOM TEMPERATURE (RT);

AGE HARDENING; CREEP; CRYSTAL GROWTH; CRYSTAL MICROSTRUCTURE; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; MICROANALYSIS; PRECIPITATION (CHEMICAL); QUENCHING; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 10444253928     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)

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