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Volumn 127, Issue 4, 2005, Pages 483-495

Test method development to quantify the in situ elastic and plastic behavior of 62%Sn-36%Pb-2%Ag solder ball arrays in commercial area array packages at -40°C, 23°C, and 125°C

Author keywords

62 63 2 solder; Area array package; BGA; Chips; Failure modes; In situ solder characterization; Printed wiring boards; Test methods

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; TENSILE STRENGTH;

EID: 29544442215     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2070048     Document Type: Article
Times cited : (13)

References (10)
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  • 5
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  • 7
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    • Thermomechanical analysis of flip chip on substrate bump assemblies
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    • Vandevelde, B., Chrisiaens, F., Beyne, E., Peeters, J., and Allaert, K., 1999, "Thermomechanical Analysis of Flip Chip on Substrate Bump Assemblies," Technical report, Karl Suss, Leuven, Belgium.
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  • 8
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  • 9
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.