-
1
-
-
0024032083
-
Thermal fatigue in solder ball arrays
-
Frear, D. R., Grivas, D., and Moris, J. W., 1988, "Thermal Fatigue in Solder Ball Arrays," J. Met. 40(6), pp. 18-22.
-
(1988)
J. Met.
, vol.40
, Issue.6
, pp. 18-22
-
-
Frear, D.R.1
Grivas, D.2
Moris, J.W.3
-
2
-
-
0026963395
-
Constitutive relations for tin-based solder balls
-
Darveaux, R., and Banerjee, K., 1992, "Constitutive Relations for Tin-Based Solder Balls," IEEE Trans. Compon., Hybrids, Manuf. Technol. 15(6), pp. 1013-1024.
-
(1992)
IEEE Trans. Compon., Hybrids, Manuf. Technol.
, vol.15
, Issue.6
, pp. 1013-1024
-
-
Darveaux, R.1
Banerjee, K.2
-
3
-
-
0034298914
-
Syntheses and characterization of thermally reworkable epoxy resin II
-
Wang, L. J., Li, H. Y., and Wong, C. P., 2000, "Syntheses and Characterization of Thermally Reworkable Epoxy Resin II," J. Polym. Sci., Part A: Polym. Chem. 38(20), pp. 3771-3782.
-
(2000)
J. Polym. Sci., Part A: Polym. Chem.
, vol.38
, Issue.20
, pp. 3771-3782
-
-
Wang, L.J.1
Li, H.Y.2
Wong, C.P.3
-
4
-
-
0033886421
-
Optimization of the substrate preheat temperature for the encapsulation of flip chip devices
-
Huang, C.Y., Shrirari, K., and Borgesen, P., 2000, "Optimization of the Substrate Preheat Temperature for the Encapsulation of Flip Chip Devices," Adv. Manuf. Technol. 16(1), pp. 55-64.
-
(2000)
Adv. Manuf. Technol.
, vol.16
, Issue.1
, pp. 55-64
-
-
Huang, C.Y.1
Shrirari, K.2
Borgesen, P.3
-
5
-
-
0034224661
-
Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies
-
Okura, J. H., Shetty, S., Ramakrishnan, B., Dasgupta, A., Caers, J. F. J. M., and Reinikainen, T., 2000, "Guidelines to Select Underfills for Flip Chip on Board Assemblies and Compliant Interposers for Chip Scale Package Assemblies," Microelectron. Reliab. 40(7), pp. 1173-1180.
-
(2000)
Microelectron. Reliab.
, vol.40
, Issue.7
, pp. 1173-1180
-
-
Okura, J.H.1
Shetty, S.2
Ramakrishnan, B.3
Dasgupta, A.4
Caers, J.F.J.M.5
Reinikainen, T.6
-
6
-
-
0024858446
-
An internal variable constitutive model for hot working of metals
-
Brown, S. B., Kim, K. H., and Anand, L., 1989, "An Internal Variable Constitutive Model for Hot Working of Metals," Int. J. Plast. 5, pp. 95-130.
-
(1989)
Int. J. Plast.
, vol.5
, pp. 95-130
-
-
Brown, S.B.1
Kim, K.H.2
Anand, L.3
-
7
-
-
28444452473
-
Thermomechanical analysis of flip chip on substrate bump assemblies
-
Karl Suss, Leuven, Belgium
-
Vandevelde, B., Chrisiaens, F., Beyne, E., Peeters, J., and Allaert, K., 1999, "Thermomechanical Analysis of Flip Chip on Substrate Bump Assemblies," Technical report, Karl Suss, Leuven, Belgium.
-
(1999)
Technical Report
-
-
Vandevelde, B.1
Chrisiaens, F.2
Beyne, E.3
Peeters, J.4
Allaert, K.5
-
8
-
-
0029389627
-
Stress relaxation behavior of eutectic tin-lead solder
-
Hare, E. W., and Slang, R. G., 1995, "Stress Relaxation Behavior of Eutectic Tin-Lead Solder," J. Electron. Mater. 24(10), pp. 1473-1484.
-
(1995)
J. Electron. Mater.
, vol.24
, Issue.10
, pp. 1473-1484
-
-
Hare, E.W.1
Slang, R.G.2
-
9
-
-
0031192444
-
Creep, stress relaxation, and plastic deformation in sn-ag and sn-zn eutectic solders
-
Mavoori, H., Chin, J., Vaynman, S., Moran, B., Keer, L., and Fine, M., 1997, "Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic Solders," J. Electron. Mater. 26(7), pp. 783-790.
-
(1997)
J. Electron. Mater.
, vol.26
, Issue.7
, pp. 783-790
-
-
Mavoori, H.1
Chin, J.2
Vaynman, S.3
Moran, B.4
Keer, L.5
Fine, M.6
-
10
-
-
0025386866
-
Reliability of soldered jointe: A description of the state of the art, part 1
-
Kluizenaar, E. E., 1990, "Reliability of Soldered Jointe: a Description of the State of the Art, Part 1," Surf. Mount. Technol., 4, pp. 27-38.
-
(1990)
Surf. Mount. Technol.
, vol.4
, pp. 27-38
-
-
Kluizenaar, E.E.1
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