SCOPUS 정보 검색 플랫폼

Journal of Materials Science Letters

Volumn 21, Issue 9, 2002, Pages 723-726

Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder

(2) Yeung, B a Jang, Jin Wook a

a MOTOROLA INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CRYSTAL MICROSTRUCTURE; EUTECTICS; FRACTURE; INTERMETALLICS; OPTICAL MICROSCOPY; SOLDERING ALLOYS; STRAIN HARDENING; TENSILE STRENGTH; TENSILE TESTING; THERMAL EFFECTS; YIELD STRESS;

INSTRON MECHANICAL TEST; PHASE RELATION;

TIN ALLOYS;

EID: 0036577727 PISSN: 02618028 EISSN: None Source Type: Journal
DOI: 10.1023/A:1015741206911 Document Type: Article

Times cited : (38)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.