Shear testing of solder joints: The effect of various parameters on the maximum shear stress of eutectic tin-lead solder

Proceedings of the TMS Fall Meeting

Volumn , Issue , 1999, Pages 107-116

  Gagliano, Robert A ^a   Fine, Morris E ^a   Vaynman, Semyon ^a   Stolkarts, Vladimir ^a  

^a NORTHWESTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COPPER; EUTECTICS; GOLD; METALLIZING; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SHEAR STRESS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN; THERMAL EXPANSION;

TIN-LEAD ALLOYS;

TIN ALLOYS;

EID: 0033298341     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)