Mechanical characterization of Sn-3.5Ag solder joints at various temperatures;Caractérisation mécanique des joints de brasage Sn-3,5Ag à diverses températures

Soldering and Surface Mount Technology

Volumn 15, Issue 3, 2003, Pages 4-5+21

  Rhee, H ^a   Subramanian, K N ^a   Lee, A ^a   Lee, J G ^a  

^a Michigan State University   (United States)

Author keywords

Deformation; Fatigue; Joining processes; Mechanical properties of materials; Soldering

Indexed keywords

CREEP; DEFORMATION; EUTECTICS; FATIGUE OF MATERIALS; GLASS; MICROSTRUCTURE; POLISHING; SHEAR STRESS; SILICA; SOLDERING; STRAIN; TIN COMPOUNDS;

EUTECTIC SOLDER JOINTS; JOINING PROCESS; SHEAR STRAIN; SOLDER PASTE; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

EID: 0242677064     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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