Mechanical properties of lead-free solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 695-706

  Darveaux, Robert ^a,b   Reichman, Corey ^a  

^a AMKOR TECHNOLOGY   (United States)

^b ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD-FREE ALLOYS; TEMPERATURE CYCLING; TENSILE LOADING;

COMPUTER SIMULATION; CREEP; HYSTERESIS LOOPS; SOLDERED JOINTS; STRAIN RATE; STRENGTH OF MATERIALS;

SOLDERING ALLOYS;

EID: 35348842657     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373872     Document Type: Conference Paper

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