Shear deformation of lead free solder joints

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 882-893

  Darveaux, Robert ^a,b  

^a AMKOR TECHNOLOGY   (United States)

^b ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP BEHAVIOR; SHEAR LOADING; WAFER LEVEL CHIP SCALE;

AGING OF MATERIALS; CREEP; DUCTILITY; LEAD; SHEAR DEFORMATION; STRENGTH OF MATERIALS;

SOLDERED JOINTS;

EID: 24644469657     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)

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