Effects of room temperature storage time on the shear strength of PBGA solder balls

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn , Issue , 2002, Pages 259-262

  Lee, S W Ricky ^a   Tsui, Yat Kit ^a   Hunag, Xingjia ^a   Yan, Eric C C ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Aging effect; PBGA; Shear strength; Solder ball

Indexed keywords

ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; MECHANICAL ENGINEERING; SOLDERING; SPHERES; TIN;

63SN37PB; AGING EFFECTS; BALL-SHEAR TEST; EUTECTIC SOLDER BALLS; EXPERIMENTAL INVESTIGATIONS; GENERAL GUIDELINES; PBGA; PLASTIC BALL GRID ARRAYS; ROOM TEMPERATURE; SOLDER BALL SHEAR; SOLDER BALLS; STORAGE TIME;

SHEAR STRENGTH;

EID: 78249246031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-39514     Document Type: Conference Paper

References (8)

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