Microstructure evolution of SnPb and SnAg/Cu BGA solder joints during thermal aging

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 39-46

  Chou, George J S ^a  

^a Tyco Electronics   (United States)

Author keywords

Ball grid array; Intermetallic layer; Microstructural evolution; Solder joint; Thermal aging

Indexed keywords

BALL GRID ARRAYS; EUTECTICS; GROWTH RATE; INTERMETALLICS; MICROSTRUCTURAL EVOLUTION; MICROSTRUCTURE; PACKAGING MATERIALS; SHEAR STRESS; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL AGING;

BGA SOLDER JOINTS; HIGH TEMPERATURE PERFORMANCE; INTERMETALLIC LAYER; MICRO-STRUCTURE EVOLUTIONS; PHASE COALESCENCE; SOLDER JOINTS; SOLID-STATE AGING; THERMAL AGING TREATMENTS;

LEAD-FREE SOLDERS;

EID: 84949953831     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990363     Document Type: Conference Paper

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