Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests

Journal of Alloys and Compounds

Volumn 428, Issue 1-2, 2007, Pages 274-285

  Ding, Ying ^a   Wang, Chunqing ^a   Tian, Yanhong ^a   Li, Mingyu ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b University Town of Shenzhen   (China)

Author keywords

96.5Sn3.5Ag eutectic solder alloy; Ag3Sn; Aging; Deformation behavior; In situ SEM

Indexed keywords

AGING OF MATERIALS; DEFORMATION; EUTECTICS; INTERMETALLICS; LEAD; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; STRAIN RATE; TIN ALLOYS;

DEFORMATION BEHAVIOR; EUTECTIC SOLDER ALLOYS; INTERGRANULAR FRACTURES; INTERPHASE BOUNDARIES;

SOLDERING ALLOYS;

EID: 33845704489     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.02.069     Document Type: Article

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