Effect of Ag and Cu concentrations on creep of Sn-based solders

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 399-405

  Chen, T ^a   Dutta, I ^a   Jadhav, S ^b  

^a Naval Postgraduate School ^*  (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTIC MICROCONSTITUENT; RATE-LIMITING CREEP; SOLUTE CONCENTRATIONS;

ACTIVATION ENERGY; BALL GRID ARRAYS; COPPER; CREEP; MICROSTRUCTURE; SILVER; VOLUME FRACTION;

SOLDERING ALLOYS;

EID: 40449112159     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33420     Document Type: Conference Paper

References (44)