High speed digital image correlation for transient-shock reliability of electronics

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 924-939

  Lall, Pradeep ^a   Panchagade, Dhananjay ^a   Iyengar, Deepti ^a   Shantaram, Sandeep ^a   Suhling, Jeff ^a   Schrier, Hubert ^b  

^a AUBURN UNIVERSITY   (United States)

^b Correlated Solutions ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP-CRACKING; DROP-IMPACT DURING SHIPPING; HIGH SPEED DIGITAL IMAGE CORRELATION; PAD CRATERING; TRANSIENT DYNAMIC DEFORMATION; TRANSIENT-SHOCK RELIABILITY OF ELECTRONICS;

DEFORMATION; DYNAMIC ANALYSIS; FINITE ELEMENT METHOD; FREIGHT TRANSPORTATION; IMAGE PROCESSING; RELIABILITY; TRANSIENT ANALYSIS;

ELECTRONIC EQUIPMENT;

EID: 35348893742     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373908     Document Type: Conference Paper

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