High resolution characterization of materials used in packages through digital image correlation

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1471-1478

  Srinivasan, V ^a   Radhakrishnan, S ^a   Zhang, X ^a   Subbarayan, G ^a   Baughn, T ^b   Nguyen, L ^c  

^a PURDUE UNIVERSITY   (United States)

^b RAYTHEON COMPANY   (United States)

^c NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CORRELATION METHODS; ELECTRONICS PACKAGING; HIGH TEMPERATURE APPLICATIONS; PATTERN RECOGNITION; ROBUSTNESS (CONTROL SYSTEMS); THERMAL EXPANSION;

ARTIFICIAL SPECKLE PATTERNS; DIGITAL IMAGE CORRELATION (DIC); DISPLACEMENT RESOLUTION;

IMAGE PROCESSING;

EID: 32844462716     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73258     Document Type: Conference Paper

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