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Microelectronic Engineering

Volumn 83, Issue 2, 2006, Pages 221-235

Behavior of (1 1 1) grains during the thermal treatment of copper film studied in situ by electron back-scatter diffraction

(4) Mirpuri, Kabir Kumar a,b Wendrock, Horst a Wetzig, Klaus a Szpunar, Jerzy b

a IFW DRESDEN (Germany)

b MCGILL UNIVERSITY (Canada)

Author keywords

Cu film; EBSD; In situ; OIM; Texture; XRD

Indexed keywords

BACKSCATTERING; COPPER; ELECTRONS; GRAIN BOUNDARIES; HEAT TREATMENT; X RAY DIFFRACTION;

CU FILM; EBSD; IN SITU; TEXTURE;

THIN FILMS;

EID: 32144456781 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2005.08.008 Document Type: Article

Times cited : (7)

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