Modeling of texture evolution in copper interconnects annealed in trenches

Scripta Materialia

Volumn 41, Issue 4, 1999, Pages 403-408

  Riege, Stefan P ^a   Thompson, Carl V ^a  

^a Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ANNEALING; CHEMICAL POLISHING; CRYSTAL ORIENTATION; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; GRAIN GROWTH; INTERFACIAL ENERGY; MATHEMATICAL MODELS; STRESS ANALYSIS; TEXTURES; THERMAL EXPANSION;

THERMAL EXPANSION COEFFICIENT;

COPPER;

EID: 0032654502     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00098-6     Document Type: Article

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