Influence of line-width on microstructure and texture of damascene copper interconnects

Materials Research Society Symposium - Proceedings

Volumn 721, Issue , 2002, Pages 137-142

  Mirpuri, Kabir J ^a   Szpunar, Jerzy A ^a   Kozaczek, Kris J ^b  

^a MCGILL UNIVERSITY   (Canada)

^b Hypernex Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL ORIENTATION; GRAIN BOUNDARIES; SCANNING ELECTRON MICROSCOPY; TEXTURES;

COPPER INTERCONNECTS;

OPTICAL INTERCONNECTS;

EID: 0036904238     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-721-j5.6     Document Type: Conference Paper

References (5)

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3. K.J. Mirpuri, J.A. Szpunar, K.J. Kozaczek, ICOTOM-13, Seoul, August 26-30, (2002) (in press).
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