Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance

Journal of Applied Physics

Volumn 85, Issue 5, 1999, Pages 2583-2590

  Vanasupa, Linda ^a,b   Joo, Young Chang ^a   Besser, Paul R ^a   Pramanick, Shekhar ^a  

^a ADVANCED MICRO DEVICES   (United States)

^b CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000193155     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.369624     Document Type: Article

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