Texture, microstructure and stress investigations in 0.18 μm damascene Cu interconnect lines

Materials Science Forum

Volumn 426-432, Issue 4, 2003, Pages 3551-3556

  Mirpuri, Kabir ^a   Cho, Jae Young ^a   Szpunar, Jerzy ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

Cu damascene; Electronic interconnect; Microstructure; OIM; Stress; Texture

Indexed keywords

GRAIN SIZE AND SHAPE; MICROSCOPIC EXAMINATION; STRESS ANALYSIS; TEXTURES; X RAY DIFFRACTION ANALYSIS;

INTERCONNECT LINES;

COPPER;

EID: 0038605309     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.426-432.3551     Document Type: Conference Paper

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