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Volumn 54, Issue 2, 2005, Pages 107-122

Impact of annealing, surface/strain energy and linewidth to line spacing ratio on texture evolution in damascene Cu interconnects

Author keywords

Copper; Electron backscatter diffraction (EBSD); Interconnects; Surface interface and strain energy; Texture

Indexed keywords

ANNEALING; INTERFACIAL ENERGY; METALLIC FILMS; MICROPROCESSOR CHIPS; OPTICAL INTERCONNECTS; STRAIN; STRENGTH OF MATERIALS; TEXTURES; TWINNING; X RAY DIFFRACTION ANALYSIS;

EID: 14044259337     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2004.11.005     Document Type: Article
Times cited : (13)

References (41)
  • 1
    • 14044260674 scopus 로고
    • SIA
    • "National Technology Roadmap for Semiconductors", SIA. 1994.
    • (1994)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.