Impact of annealing, surface/strain energy and linewidth to line spacing ratio on texture evolution in damascene Cu interconnects

Materials Characterization

Volumn 54, Issue 2, 2005, Pages 107-122

  Mirpuri, Kabirkumar ^a   Szpunar, Jerzy ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

Copper; Electron backscatter diffraction (EBSD); Interconnects; Surface interface and strain energy; Texture

Indexed keywords

ANNEALING; INTERFACIAL ENERGY; METALLIC FILMS; MICROPROCESSOR CHIPS; OPTICAL INTERCONNECTS; STRAIN; STRENGTH OF MATERIALS; TEXTURES; TWINNING; X RAY DIFFRACTION ANALYSIS;

ELECTRON BACKSCATTER DIFFRACTION (EBSD); ORIENTATION IMAGING SPECTROSCOPY (OIM); SURFACE/INTERFACE AND STRAIN ENERGY; TEXTURE STRENGTH;

COPPER;

EID: 14044259337     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2004.11.005     Document Type: Article

References (41)

1. "National Technology Roadmap for Semiconductors", SIA. 1994.
2. D. Edelstein, J. Heidenreich, R. Goldblatt, W. Cote, C. Uzoh, and N. Lustig Tech. Dig.-IEEE Int. Electron Devices Meet. 1997 773
3. J.M.E. Harper, C. Cabral Jr., P.C. Andricacos, L. Gignac, I.C. Noyan, and K.P. Rodbell J. Appl. Phys. 86 5 1999 2516 2525
4. H. Lee, S.D. Lopatin, and S.S. Wong Proceedings of the IEEE international interconnect technology conference 2000 114 116
5. S.H. Brongersma, I. Vervoort, M. Judelwicz, H. Bender, T. Conard, and W. Vandervorst Proceedings of the IEEE international interconnect technology conference 1999 290 292
6. S.H. Brongersma, E. Kerr, I. Vervoort, A. Saerens, and K. Maex J. Mater. Res. 17 3 2002 582 589
7. M.S. Yoon, Y.C. Park, and Y.C. Joo Thin Solid Films 408 2002 230 235
8. C. Ryu, K.-W. Kwon, L.S. Loke, H. Lee, T. Nogami, and V.M. Dubin IEEE Trans. Electron Devices 40 1999 1113 1123
9. L. Vanasupa, Y.C. Joo, P.R. Besser, and S. Pramanick J. Appl. Phys. 85 5 1999 2583 2590
10. E. Zschech, W. Blum, I. Zienert, and P.R. Besser Z. Met.Kd. 92 7 2001 803 809
11. L. Vanasupa, D. Pinck, Y.C. Joo, T. Nogami, S. Pramanick, and S. Lopatin Electrochem. Solid-State Lett. 2 6 1999 275 277
12. S.P. Riege, and C.V. Thompson Scr. Mater. 41 4 1999 403 408
13. T.J. Balk, G. Dehm, and E. Arzt Acta Mater. 51 15 2003 4471 4485
14. Kabirkumar Mirpuri, and Jerzy Szpunar Micron 35 7 2004 575 587
15. Li H. TexTools - Ver. 3.1, www.Resmat.com. 2000.
16. K. Mirpuri, and J. Szpunar Phys. Met. Metallogr. 96 Suppl. I 2003 S59 S69
17. C. Lingk, M.E. Gross, and W.L. Brown J. Appl. Phys. 87 5 2000 2232 2236
18. M.E. Gross, R. Drese, C. Lingk, W.L. Brown, K. Evans-Lutterodt, and D. Barr Mater. Res. Soc. Symp. Proc. 562 1999 215 222
19. H. Okabayashi, K. Ueno, S. Saitoh, and E. Nomura Advanced metallization conference 2000 93 99
20. Q.-T. Jiang, R. Mikkola, R. Ortega, and V. Blaschke Mater. Res. Soc. Symp. Proc. 562 1999 229 234
21. D.P. Field Proceedings of the twelfth international conference on textures of materials (ICOTOM-12) vol. 2 1999 1309 1314
22. T. Ritzdorf, L. Graham, S. Jin, C. Mu, and D. Fraser Proceedings of the IEEE international interconnect technology conference 1998 166 168
23. V.M. Dubin, G. Morales, C. Ryu, and S.S. Wong Mater. Res. Soc. Symp. Proc. 505 1998 137 142
24. K. Ueno, T. Ritzdorf, and S. Grace Advanced metallization conference 1999 95 101
25. Q.-T. Jiang, R. Faust, H. Lam, and J. Mucha Proceedings of the IEEE international interconnect technology conference 1999 125 127
26. C. Lingk, and M.E. Gross J. Appl. Phys. 84 10 1998 5547 5553
27. P. Gudmundson, and A. Wikstrom Microelectron. Eng. 60 2000 17 29
28. M.A. Gribelyuk, S.G. Malhotra, P.S. Locke, P. DeHaven, J. Fluegel, and C. Parks Proceedings of the IEEE international interconnect technology conference 2000 188 189
29. K.J. Mirpuri, J.A. Szpunar, and K.J. Kozaczek AIP Conf. Proc. 683 1 2003 494 498
30. K.J. Mirpuri, J.Y. Cho, and J.A. Szpunar Mater. Sci. Forum 426-432 4 2003 3551 3556
31. C.V. Thompson, and R. Carel J. Mech. Phys. Solids 44 1996 657
32. C.V. Thompson, and R. Carel Mater. Sci. Eng., B, Solid-State Mater. Adv. Technol. 32 1995 211 219
33. O. Sicardy, I. Touet, L. Arnaud, F. Charlet, and T. Berger Mater. Sci. Forum 347-349 2000 562 567
34. H. Lee, S.D. Lopatin, A.F. Marshall, and S.S. Wong Proceedings of the IEEE international interconnect technology conference 2001 236 238
35. J.M. Zhang, K.W. Wei, and V. Ji Appl. Surf. Sci. 187 2002 60 67
36. J.M. Zhang, K.-W. Xu, and V. Ji J. Cryst. Growth 226 2001 168 174
37. J. Zhang, K. Xu, and J. He J. Mater. Sci. Lett. 18 1999 471 473
38. H.L. Wei, H. Huang, C.H. Woo, R.K. Zheng, G.H. Wen, and X.X. Zhang Appl. Phys. Lett. 80 13 2002 2290 2292
39. V.M. Kozlov, and L. Peraldo Bicelli Mater. Chem. Phys. 77 2002 289 293
40. K.J. Mirpuri, H. Wendrock, S. Menzel, K. Wetzig, and J. Szpunar Microelectron. Eng. 76/1-4 2004 160 166
41. Mirpuri K, Wendrock H, Wetzig K, Szpunar J. Thin Solid Films, unpublished.