Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

Journal of Applied Physics

Volumn 86, Issue 5, 1999, Pages 2516-2525

  Harper, J M E ^a   Cabral Jr , C ^a   Andricacos, P C ^a   Gignac, L ^a   Noyan, I C ^a   Rodbell, K P ^a   Hu, C K ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; COPPER PLATING; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTROPLATING; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HARDNESS; METALLOGRAPHIC MICROSTRUCTURE; THIN FILMS;

GRAIN BOUNDARY PINNING;

METALLIC FILMS;

EID: 0032620394     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.371086     Document Type: Article

References (60)

1. The National Technology Roadmap for Semiconductors (Semiconductor Industry Association, San Jose, CA, 1997).
2. D. Edelstein et al., 1997 IEEE Int. Electron Devices Meet. Digest, p. 773 (1997); M. M. Chow, W. L. Guthrie, J. E. Cronin, C. W. Kaanta, B. Luther, K. A. Perry, and C. L. Stanley, US Patent No. 4,789,648 (1988).
3. D. Edelstein et al., 1997 IEEE Int. Electron Devices Meet. Digest, p. 773 (1997); M. M. Chow, W. L. Guthrie, J. E. Cronin, C. W. Kaanta, B. Luther, K. A. Perry, and C. L. Stanley, US Patent No. 4,789,648 (1988).
4. P. C. Andricacos, C. Uzoh, J. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Dev. 42, 567 (1998).
5. C. Cabral, Jr., et al., Proc. Adv. Metall. Conf. 14, 81 (1999).
6. T. Ritzdorf, L. Graham, S. Jin, C. Mu, and D. B. Fraser, Proceedings of the International Interconnect Technology Conference (IEEE, New York, 1998), p. 166.
7. M. E. Gross et al., Mater. Res. Soc. Symp. Proc. 514, 293 (1998); M. E. Gross, K. Takahashi, T. Ritzdorf, and K. Gibbons, Proc. Adv. Metall. Conf., Colorado Springs (1998).
8. M. E. Gross et al., Mater. Res. Soc. Symp. Proc. 514, 293 (1998); M. E. Gross, K. Takahashi, T. Ritzdorf, and K. Gibbons, Proc. Adv. Metall. Conf., Colorado Springs (1998).
9. V. M. Dubin, G. Morales, C. Ryu, and S. S. Wong, Mater. Res. Soc. Symp. Proc. 505, 137 (1998).
10. C. Lingk and M. E. Gross, J. Appl. Phys. 84, 5547 (1998); C. Lingk et al., Proc. Adv. Metall. Conf., Colorado Springs (1998).
11. C. Lingk and M. E. Gross, J. Appl. Phys. 84, 5547 (1998); C. Lingk et al., Proc. Adv. Metall. Conf., Colorado Springs (1998).
12. Q.-T. Jiang, R. Mikkola, B. Carpenter, and M. E. Thomas, Proc. Adv. Metall. Conf., Colorado Springs (1998); Q.-T. Jiang and K. Smekalin, ibid. (1998).
13. Q.-T. Jiang, R. Mikkola, B. Carpenter, and M. E. Thomas, Proc. Adv. Metall. Conf., Colorado Springs (1998); Q.-T. Jiang and K. Smekalin, ibid. (1998).
14. L. M. Gignac, K. P. Rodbell, C. Cabral, Jr., P. C. Andricacos, P. S. Locke, S. J. Klepeis, R. B. Beyers, and P. M. Rice, Mater. Res. Soc. Symp. Proc. (to be published).
15. A. F. Mayadas and M. Shatzkes, Phys. Rev. B 1, 1382 (1970).
16. P. Chaudhari, J. Vac. Sci. Technol. 9, 520 (1972).
17. E. O. Hall, Proc. Phys. Soc. London 643, 747 (1951); N. J. Petch, J. Iron Steel Inst., London 173, 25 (1953).
18. E. O. Hall, Proc. Phys. Soc. London 643, 747 (1951); N. J. Petch, J. Iron Steel Inst., London 173, 25 (1953).
19. I. J. M. M. Raaijmakers, Ph.D. thesis, Technical University of Eindhoven (1988), p. 76.
20. C. Zener, Trans. AIME 175, 15 (1948).
21. Recrystallization of Metallic Materials, edited by F. Haessner (Dr. Riederer Verlag, Stuttgart, Germany, 1978), p. 124.
22. F. J. Humphreys and M. Hatherly, Recrystallization and Related Annealing Phenomena (Elsevier Science, Oxford, 1996), p. 314.
23. D. Gupta, Mater. Res. Soc. Symp. Proc. 337, 209 (1994).
24. J. M. E. Harper, E. G. Colgan, C. K. Hu, J. Hummel, L. P. Buchwalter, and C. E. Uzoh, Mater. Res. Bull. 19, 23 (1994).
25. R. G. Chambers, Proc. R. Soc. London, Ser. A 202, 378 (1950).
26. F. Blatt, Physics of Electronic Conduction in Solids (McGraw-Hill, New York, 1968).
27. Handbook of Electrical Resistivities of Binary Metallic Alloys (CRC Press, Cleveland, 1983).
28. P. J. Schultz and K. G. Lynn, Rev. Mod. Phys. 60, 701 (1988); K. P. Rodbell, M. Weber, and K. G. Lynn, unpublished results (1998).
29. P. J. Schultz and K. G. Lynn, Rev. Mod. Phys. 60, 701 (1988); K. P. Rodbell, M. Weber, and K. G. Lynn, unpublished results (1998).
30. Physical Metallurgy, edited by R. W. Cahn and P. Haasen (North-Holland, Amsterdam, 1996), p. 1435.
31. S. Murarka, Metallization Theory and Practice for VLSI and ULSI (Butterworth-Heinemann, Boston, 1993), p. 19.
32. G. E. Dieter, Mechanical Metallurgy (McGraw-Hill, New York, 1986), p. 9.
33. Q. Z. Hong, F. M. d'Heurle, J. M. E. Harper, and S. Q. Hong, Appl. Phys. Lett. 62, 2637 (1993).
34. R. Venkatraman and J. C. Bravman, Mater. Res. Soc. Symp. Proc. 239, 127 (1992).
35. W. D. Nix, Metall. Trans. A 20, 2217 (1989).
36. C. V. Thompson and R. Carel, J. Mech. Phys. Solids 44, 657 (1996).
37. P. Chaudhari, Philos. Mag. 39, 507 (1979).
38. E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Mater. Res. Soc. Symp. Proc. 391, 103 (1995).
39. C. V. Thompson, J. Appl. Phys. 58, 763 (1985).
40. K. P. Rodbell and R. H. Koch, Phys. Rev. B 44, 1767 (1991).
41. D. P. Tracy, D. B. Knorr, and K. P. Rodbell, J. Appl. Phys. 76, 2671 (1994).
42. J. Gupta, J. M. E. Harper, J. L. Mauer IV, P. G. Blauner, and D. A. Smith. Appl. Phys. Lett. 61, 663 (1992).
43. J. W. Patten, E. D. McClanahan, and J. W. Johnson, J. Appl. Phys. 42, 4371 (1971).
44. B. M. Hogan, Proc. Surf.-Finish 84, Amer. Electroplaters and Surface Finishers Soc., Orlando (1984); H. J. Wiesner and W. J. Frey, Plat. Surf. Finish. 66, 51 (1979).
45. B. M. Hogan, Proc. Surf.-Finish 84, Amer. Electroplaters and Surface Finishers Soc., Orlando (1984); H. J. Wiesner and W. J. Frey, Plat. Surf. Finish. 66, 51 (1979).
46. J. M. E. Harper, J. Gupta, D. A. Smith, J. W. Chang, K. L. Holloway, C. Cabral, Jr., D. P. Tracy, and D. B. Knorr, Appl. Phys. Lett. 65, 177 (1994).
47. A. Gangulee and F. M. d'Heurle, Thin Solid Films 12, 399 (1972).
48. H. P. Longworth and C. V. Thompson, J. Appl. Phys. 69, 3929 (1991).
49. W. W. Mullins, Acta Metall. 6, 414 (1958).
50. M. F. Ashby, J. M. E. Harper, and J. Lewis, Trans. Metall. Soc. AIME 245, 413 (1969).
51. M. Hillert, Acta Metall. 36, 3177 (1988).
52. D. A. Porter and K. E. Easterling, Phase Transformations in Metals and Alloys (Van Nostrand Reinhold, UK, 1984), p. 141.
53. G. Bai et al., 1996 IEEE Symp. on VLSI Technol. Digest (1996), p. 48.
54. J. M. E. Harper and K. P. Rodbell, J. Vac. Sci. Technol. B 15, 763 (1997).
55. K. Lucke and H. P. Stuwe, in Recovery and Recrystallization of Metals, edited by L. Himmel (Interscience, New York, 1963), p. 171.
56. Fundamentals of Grain and Interphase Boundary Diffusion, edited by I. Kaur and W. Gust (Ziegler, Stuttgart, Germany, 1989), p. 162.
57. Diffusion Phenomena in Thin Films and Microelectronic Materials, edited by D. Gupta and P. S. Ho (Noyes, Park Ridge, NJ, 1988), p. 43.
58. C. K. Hu, K. L. Lee, D. Gupta, and P. Blauner, Mater. Res. Soc. Symp. Proc. 427, 95 (1996).
59. Reference 50, p. 23.
60. P. Shewmon, Diffusion in Solids (The Minerals, Metals and Materials Society, Warrendale, PA, 1989), p. 78.