Influence of Cu seed deposition temperature on electroplated Cu texture formation in damascene structures

Materials Research Society Symposium - Proceedings

Volumn 562, Issue , 1999, Pages 229-234

  Jiang, Qing Tang ^a   Mikkola, Robert ^a   Ortega, Richard ^a   Blaschke, Volker ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; ELECTRIC RESISTANCE; ELECTROPLATING; FILM GROWTH; METALLIC FILMS; METALLOGRAPHIC MICROSTRUCTURE; THERMAL EFFECTS; VAPOR DEPOSITION; X RAY ANALYSIS;

DAMASCENE STRUCTURES; PHYSICAL VAPOR DEPOSITION (PVD); X RAY POLE FIGURE ANALYSIS;

COPPER PLATING;

EID: 0033347587     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-562-229     Document Type: Conference Paper

References (6)