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Journal of Electronic Materials

Volumn 32, Issue 10, 2003, Pages 1012-1022

Effect of stresses on the evolution of annealing textures in Cu and Al interconnects

(2) Lee, Dong Nyung a Lee, Hyo Jong a

a Seoul National University (South Korea)

Author keywords

Aluminum interconnect; Annealing textures; Copper interconnects; Strain energy; Surface energy

Indexed keywords

ALUMINUM; ANNEALING; COPPER; ELASTICITY; INTERFACIAL ENERGY; MATHEMATICAL MODELS; STRAIN; STRESSES; TEXTURES;

ANNEALING TEXTURES; COPPER INTERCONNECTS; DAMASCENE;

POLYCRYSTALLINE MATERIALS;

EID: 0242336536 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-003-0083-5 Document Type: Article

Times cited : (40)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.