메뉴 건너뛰기




Volumn 1-9, Issue , 2003, Pages 265-324

8.08 - Reliability of Metal Interconnects

Author keywords

[No Author keywords available]

Indexed keywords


EID: 85146783652     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1016/B0-08-043749-4/08125-8     Document Type: Chapter
Times cited : (3)

References (145)
  • 1
    • 0000509119 scopus 로고
    • Coating, mechanical constraints, and pressure effects on electromigration
    • N.G. Ainslie, F.M. d'Heurle and O.C. Wells (1972) Coating, mechanical constraints, and pressure effects on electromigration. Appl. Phys. Lett. 20 173-174.
    • (1972) Appl. Phys. Lett. , vol.20 , pp. 173-174
    • Ainslie, N.G.1    d'Heurle, F.M.2    Wells, O.C.3
  • 2
    • 0028741076 scopus 로고
    • A simple test chip to assess chip and package design in the case of plastic assembling
    • (correction in 1995, 18, 862–863)
    • P. Alpern, V. Wicher and R. Tilgner (1994) A simple test chip to assess chip and package design in the case of plastic assembling. IEEE Trans. Compon. Pack. Manuf. Technol. A 17 583-589. (correction in 1995, 18, 862–863)
    • (1994) IEEE Trans. Compon. Pack. Manuf. Technol. A , vol.17 , pp. 583-589
    • Alpern, P.1    Wicher, V.2    Tilgner, R.3
  • 3
    • 0036849829 scopus 로고    scopus 로고
    • The role of initial flaw size and plasticity in adjacent layers in channeling crack growth in thin films
    • J.M. Ambrico and M.R. Begley (2002) The role of initial flaw size and plasticity in adjacent layers in channeling crack growth in thin films. Thin Solid Films 419 144-153.
    • (2002) Thin Solid Films , vol.419 , pp. 144-153
    • Ambrico, J.M.1    Begley, M.R.2
  • 4
    • 0037066171 scopus 로고    scopus 로고
    • Cracking in thin multi-layers with finite width and periodic architectures
    • J.M. Ambrico, E.E. Jones and M.R. Begley (2002) Cracking in thin multi-layers with finite width and periodic architectures. Int. J. Solids Struct. 39 1443-1462.
    • (2002) Int. J. Solids Struct. , vol.39 , pp. 1443-1462
    • Ambrico, J.M.1    Jones, E.E.2    Begley, M.R.3
  • 5
    • 0014820722 scopus 로고
    • Reduction of electromigration in aluminum films by copper doping
    • I. Ames, F. d'Heurle and R. Horstmann (1970) Reduction of electromigration in aluminum films by copper doping. IBM J. Res. Develop. 14 461-463.
    • (1970) IBM J. Res. Develop. , vol.14 , pp. 461-463
    • Ames, I.1    d'Heurle, F.2    Horstmann, R.3
  • 6
    • 0000916994 scopus 로고    scopus 로고
    • Mechanism maps for electromigration-induced failure of metal and alloy interconnects
    • V.K. Andleigh, V.T. Srikar, Y.J. Park and C.V. Thompson (1999) Mechanism maps for electromigration-induced failure of metal and alloy interconnects. J. Appl. Phys. 86 6737-6745.
    • (1999) J. Appl. Phys. , vol.86 , pp. 6737-6745
    • Andleigh, V.K.1    Srikar, V.T.2    Park, Y.J.3    Thompson, C.V.4
  • 7
    • 0028491015 scopus 로고
    • Electromigration failure by shape change of voids in bamboo lines
    • E. Arzt, O. Kraft, W.D. Nix and J.E. Sanchez (1994) Electromigration failure by shape change of voids in bamboo lines. J. Appl. Phys. 76 1563-1571.
    • (1994) J. Appl. Phys. , vol.76 , pp. 1563-1571
    • Arzt, E.1    Kraft, O.2    Nix, W.D.3    Sanchez, J.E.4
  • 8
    • 0028468445 scopus 로고
    • A new procedure for measuring the decohesion energy for thin ductile films on substrate
    • A. Bagchi, G.E. Lucus, Z. Suo and A.G. Evans (1994) A new procedure for measuring the decohesion energy for thin ductile films on substrate. J. Mater. Res. 9 1734-1741.
    • (1994) J. Mater. Res. , vol.9 , pp. 1734-1741
    • Bagchi, A.1    Lucus, G.E.2    Suo, Z.3    Evans, A.G.4
  • 9
    • 0035902690 scopus 로고    scopus 로고
    • Thermomechanical behavior of different texture components in Cu thin films
    • S.P. Baker, A. Kretschmann and E. Arzt (2001) Thermomechanical behavior of different texture components in Cu thin films. Acta Mater. 49 2145-2160.
    • (2001) Acta Mater. , vol.49 , pp. 2145-2160
    • Baker, S.P.1    Kretschmann, A.2    Arzt, E.3
  • 10
    • 0000769923 scopus 로고    scopus 로고
    • Progressive cracking of a multilayer system upon thermal cycling
    • M.R. Begley and A.G. Evans (2001) Progressive cracking of a multilayer system upon thermal cycling. J. Appl. Mech. 68 513-520.
    • (2001) J. Appl. Mech. , vol.68 , pp. 513-520
    • Begley, M.R.1    Evans, A.G.2
  • 11
    • 0026692234 scopus 로고
    • Cracking of thin bonded films in residual tension
    • J.L. Beuth (1992) Cracking of thin bonded films in residual tension. Int. J. Solids Struct. 29 1657-1675.
    • (1992) Int. J. Solids Struct. , vol.29 , pp. 1657-1675
    • Beuth, J.L.1
  • 12
    • 0030244071 scopus 로고    scopus 로고
    • Cracking of thin films bonded to elastic–plastic substrates
    • J.L. Beuth and N.W. Klingbeil (1996) Cracking of thin films bonded to elastic–plastic substrates. J. Mech. Phys. Solids 44 1411-1428.
    • (1996) J. Mech. Phys. Solids , vol.44 , pp. 1411-1428
    • Beuth, J.L.1    Klingbeil, N.W.2
  • 13
    • 84937650904 scopus 로고
    • Electromigration—a brief survey and some recent results
    • J.R. Black (1969) Electromigration—a brief survey and some recent results. IEEE Trans. Electron Devices ED-16 338-347.
    • (1969) IEEE Trans. Electron Devices , vol.ED-16 , pp. 338-347
    • Black, J.R.1
  • 14
    • 0016940795 scopus 로고
    • Electromigration in thin aluminum films on titanium nitride
    • I.A. Blech (1976) Electromigration in thin aluminum films on titanium nitride. J. Appl. Phys. 47 1203-1208.
    • (1976) J. Appl. Phys. , vol.47 , pp. 1203-1208
    • Blech, I.A.1
  • 15
    • 0016473653 scopus 로고
    • Electromigration in thin gold films on molybdenum surfaces
    • I.A. Blech and E. Kinsbron (1975) Electromigration in thin gold films on molybdenum surfaces. Thin Solid Films 25 327-334.
    • (1975) Thin Solid Films , vol.25 , pp. 327-334
    • Blech, I.A.1    Kinsbron, E.2
  • 16
    • 36849109026 scopus 로고
    • Direct transmission electron microscope observation of electrotransport in aluminum thin films
    • I.A. Blech and E.S. Meieran (1967) Direct transmission electron microscope observation of electrotransport in aluminum thin films. Appl. Phys. Lett. 11 263-265.
    • (1967) Appl. Phys. Lett. , vol.11 , pp. 263-265
    • Blech, I.A.1    Meieran, E.S.2
  • 17
    • 0001709094 scopus 로고
    • Elastic–plastic behaviour of thin tubes subjected to internal pressure and intermittent high-heat fluxes with application to fast-nuclear-reactor fuel elements
    • J. Bree (1967) Elastic–plastic behaviour of thin tubes subjected to internal pressure and intermittent high-heat fluxes with application to fast-nuclear-reactor fuel elements. J. Strain Analysis 2 226-238.
    • (1967) J. Strain Analysis , vol.2 , pp. 226-238
    • Bree, J.1
  • 19
    • 0024683924 scopus 로고
    • An experimental study of the fracture resistance of bimaterial interface
    • H.C. Cao and A.G. Evans (1989) An experimental study of the fracture resistance of bimaterial interface. Mech. Mater. 7 295-305.
    • (1989) Mech. Mater. , vol.7 , pp. 295-305
    • Cao, H.C.1    Evans, A.G.2
  • 20
    • 0024621114 scopus 로고
    • A test specimen for determining the fracture resistance of bimaterial interfaces
    • P.G. Charalambides, J. Lund, A.G. Evans and R.M. McMeeking (1989) A test specimen for determining the fracture resistance of bimaterial interfaces. J. Appl. Mech. 56 77-82.
    • (1989) J. Appl. Mech. , vol.56 , pp. 77-82
    • Charalambides, P.G.1    Lund, J.2    Evans, A.G.3    McMeeking, R.M.4
  • 21
    • 0001613321 scopus 로고    scopus 로고
    • Dielectric cracking produced by electromigration in microelectronic interconnects
    • S. Chiras and D.R. Clarke (2000) Dielectric cracking produced by electromigration in microelectronic interconnects. J. Appl. Phys. 88 6302-6312.
    • (2000) J. Appl. Phys. , vol.88 , pp. 6302-6312
    • Chiras, S.1    Clarke, D.R.2
  • 22
    • 0018440402 scopus 로고
    • Non-equilibrium models for diffusive cavitation of grain interfaces
    • T.-J. Chuang, K.I. Kagawa, J.R. Rice and L.B. Sills (1979) Non-equilibrium models for diffusive cavitation of grain interfaces. Acta Metall. 27 265-284.
    • (1979) Acta Metall. , vol.27 , pp. 265-284
    • Chuang, T.-J.1    Kagawa, K.I.2    Rice, J.R.3    Sills, L.B.4
  • 23
    • 0000434759 scopus 로고    scopus 로고
    • Stress–corrosion cracking of low-dielectric-constant spin-on-glass thin films
    • R.F. Cook and E.G. Liniger (1999) Stress–corrosion cracking of low-dielectric-constant spin-on-glass thin films. J. Electochem. Soc. 146 4439-4448.
    • (1999) J. Electochem. Soc. , vol.146 , pp. 4439-4448
    • Cook, R.F.1    Liniger, E.G.2
  • 25
    • 0032148208 scopus 로고    scopus 로고
    • Adhesion and debonding of multi-layer thin film structures
    • R.H. Dauskardt, M. Lane, Q. Ma and N. Krishna (1998) Adhesion and debonding of multi-layer thin film structures. Eng. Fract. Mech. 61 141-162.
    • (1998) Eng. Fract. Mech. , vol.61 , pp. 141-162
    • Dauskardt, R.H.1    Lane, M.2    Ma, Q.3    Krishna, N.4
  • 26
    • 0003659399 scopus 로고
    • Electromigration in thin films
    • J. Poate, K.N. Tu, J. Mayer (Eds), New York: Wiley
    • F.M. d'Heurle and P.S. Ho (1978) Electromigration in thin films. J. Poate, K.N. Tu, J. Mayer (Eds) Thin Films: Interdiffusion and Reactions New York: Wiley 243-303.
    • (1978) Thin Films: Interdiffusion and Reactions , pp. 243-303
    • d'Heurle, F.M.1    Ho, P.S.2
  • 27
    • 0001714232 scopus 로고
    • Electromigration in thin films
    • G. Hass, M. Francombe, R. Hoffman (Eds), New York: Academic Press
    • F.M. d'Heurle and R. Rosenberg (1973) Electromigration in thin films. G. Hass, M. Francombe, R. Hoffman (Eds) Physics of Thin Films vol. 7 New York: Academic Press 257-310.
    • (1973) Physics of Thin Films , vol.7 , pp. 257-310
    • d'Heurle, F.M.1    Rosenberg, R.2
  • 29
    • 85007836717 scopus 로고
    • On the crack extension in plates under plane loading and transverse shear
    • F. Erdogan and G.C. Sih (1963) On the crack extension in plates under plane loading and transverse shear. J. Basic Eng., Trans. ASME 85 519-527.
    • (1963) J. Basic Eng., Trans. ASME , vol.85 , pp. 519-527
    • Erdogan, F.1    Sih, G.C.2
  • 30
    • 0024069796 scopus 로고
    • The cracking and decohesion of thin films
    • A.G. Evans, M.D. Drory and M.S. Hu (1988) The cracking and decohesion of thin films. J. Mater. Res. 3 1043-1049.
    • (1988) J. Mater. Res. , vol.3 , pp. 1043-1049
    • Evans, A.G.1    Drory, M.D.2    Hu, M.S.3
  • 31
    • 0029346335 scopus 로고
    • The thermomechanical integrity of thin films and multilayers
    • A.G. Evans and J.W. Hutchinson (1995) The thermomechanical integrity of thin films and multilayers. Acta Metall. Mater. 43 2507-2530.
    • (1995) Acta Metall. Mater. , vol.43 , pp. 2507-2530
    • Evans, A.G.1    Hutchinson, J.W.2
  • 32
    • 0001065090 scopus 로고
    • The electromigration short-length effect in Ti–AlCu–Ti metallization with tungsten studs
    • R.G. Filippi, G.A. Biery and R.A. Wachnik (1995) The electromigration short-length effect in Ti–AlCu–Ti metallization with tungsten studs. J. Appl. Phys. 78 3756-3768.
    • (1995) J. Appl. Phys. , vol.78 , pp. 3756-3768
    • Filippi, R.G.1    Biery, G.A.2    Wachnik, R.A.3
  • 36
    • 0032684355 scopus 로고    scopus 로고
    • Crack-like grain-boundary diffusion wedges in thin metal films
    • H. Gao, L. Zhang, W.D. Nix, C.V. Thompson and E. Arzt (1999) Crack-like grain-boundary diffusion wedges in thin metal films. Acta Mater. 47 2865-2878.
    • (1999) Acta Mater. , vol.47 , pp. 2865-2878
    • Gao, H.1    Zhang, L.2    Nix, W.D.3    Thompson, C.V.4    Arzt, E.5
  • 38
    • 0032124054 scopus 로고    scopus 로고
    • Evolution of stresses in passivated and unpassivated metal interconnects
    • A. Gouldstone, Y.L. Shen, S. Suresh and C.V. Thompson (1998) Evolution of stresses in passivated and unpassivated metal interconnects. J. Mater. Res. 13 1956-1966.
    • (1998) J. Mater. Res. , vol.13 , pp. 1956-1966
    • Gouldstone, A.1    Shen, Y.L.2    Suresh, S.3    Thompson, C.V.4
  • 39
    • 0000881016 scopus 로고
    • Stress in metal lines under passivation—comparison of experiment with finite-element calculations
    • B. Greenebaum, A.I. Sauter, P.A. Flinn and W.D. Nix (1991) Stress in metal lines under passivation—comparison of experiment with finite-element calculations. Appl. Phys. Lett. 58 1845-1847.
    • (1991) Appl. Phys. Lett. , vol.58 , pp. 1845-1847
    • Greenebaum, B.1    Sauter, A.I.2    Flinn, P.A.3    Nix, W.D.4
  • 41
    • 0040621790 scopus 로고    scopus 로고
    • Flip-chip BGA design to avert die cracking
    • J.B. Han (2001) Flip-chip BGA design to avert die cracking. J. Electron. Packag. 123 58-63.
    • (2001) J. Electron. Packag. , vol.123 , pp. 58-63
    • Han, J.B.1
  • 42
    • 84903399479 scopus 로고    scopus 로고
    • Immortality of Cu damascene interconnects
    • S.P. Baker, M.A. Korhonen, E. Arzt, P.S. Ho (Eds), Melville, NY: Am. Inst. Phys
    • S.P. Hau-Riege (2001) Immortality of Cu damascene interconnects. S.P. Baker, M.A. Korhonen, E. Arzt, P.S. Ho (Eds) 6th International Workshop on Stress-induced Phenomena in Metallization Melville, NY: Am. Inst. Phys 21-32.
    • (2001) 6th International Workshop on Stress-induced Phenomena in Metallization , pp. 21-32
    • Hau-Riege, S.P.1
  • 43
    • 0034256167 scopus 로고    scopus 로고
    • The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects
    • S.P. Hau-Riege and C.V. Thompson (2000) The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects. J. Mater. Res. 15 1797-1802.
    • (2000) J. Mater. Res. , vol.15 , pp. 1797-1802
    • Hau-Riege, S.P.1    Thompson, C.V.2
  • 44
    • 0033737954 scopus 로고    scopus 로고
    • The ratcheting of compressed thermally grown thin films on ductile substrates
    • M.Y. He, A.G. Evans and J.W. Hutchinson (2000) The ratcheting of compressed thermally grown thin films on ductile substrates. Acta Mater. 48 2593-2601.
    • (2000) Acta Mater. , vol.48 , pp. 2593-2601
    • He, M.Y.1    Evans, A.G.2    Hutchinson, J.W.3
  • 46
    • 0000972637 scopus 로고
    • A study on stress-induced migration in aluminum metallization based on direct stress measurements
    • K. Hinode, I. Asano, T. Ishiba and Y. Homma (1990) A study on stress-induced migration in aluminum metallization based on direct stress measurements. J. Vac. Sci. Technol. B8 495-498.
    • (1990) J. Vac. Sci. Technol. , vol.B8 , pp. 495-498
    • Hinode, K.1    Asano, I.2    Ishiba, T.3    Homma, Y.4
  • 47
    • 1842617942 scopus 로고
    • Electromigration in metals
    • P.S. Ho and T. Kwok (1989) Electromigration in metals. Rep. Progr. Phys. 52 301-347.
    • (1989) Rep. Progr. Phys. , vol.52 , pp. 301-347
    • Ho, P.S.1    Kwok, T.2
  • 49
    • 0017997008 scopus 로고
    • Intermetallic compounds of Al and transitions metals: effect of electromigration in 1−2-μm-wide lines
    • J.K. Howard, J.F. White and P.S. Ho (1978) Intermetallic compounds of Al and transitions metals: effect of electromigration in 1−2-μm-wide lines. J. Appl. Phys. 49 4083-4093.
    • (1978) J. Appl. Phys. , vol.49 , pp. 4083-4093
    • Howard, J.K.1    White, J.F.2    Ho, P.S.3
  • 50
    • 0028444123 scopus 로고
    • Cleavage due to dislocation confinement in layered materials
    • K.J. Hsia, Z. Suo and W. Yang (1994) Cleavage due to dislocation confinement in layered materials. J. Mech. Phys. Solids 42 877-896.
    • (1994) J. Mech. Phys. Solids , vol.42 , pp. 877-896
    • Hsia, K.J.1    Suo, Z.2    Yang, W.3
  • 51
    • 0000555230 scopus 로고    scopus 로고
    • Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
    • C.-K. Hu, L. Gignac, S.G. Malhotra and R. Rosenberg (2001) Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections. Appl. Phys. Lett. 78 904-906.
    • (2001) Appl. Phys. Lett. , vol.78 , pp. 904-906
    • Hu, C.-K.1    Gignac, L.2    Malhotra, S.G.3    Rosenberg, R.4
  • 52
    • 0029333576 scopus 로고
    • Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
    • C.-K. Hu, K.P. Rodbell, T.D. Sullivan, K.Y. Lee and D.P. Bouldin (1995) Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM J. Res. Develop. 39 465-497.
    • (1995) IBM J. Res. Develop. , vol.39 , pp. 465-497
    • Hu, C.-K.1    Rodbell, K.P.2    Sullivan, T.D.3    Lee, K.Y.4    Bouldin, D.P.5
  • 53
    • 0000034975 scopus 로고    scopus 로고
    • Electromigration path in Cu thin-film lines
    • C.-K. Hu, R. Rosenberg and K.Y. Lee (1999) Electromigration path in Cu thin-film lines. Appl. Phys. Lett. 74 2945-2947.
    • (1999) Appl. Phys. Lett. , vol.74 , pp. 2945-2947
    • Hu, C.-K.1    Rosenberg, R.2    Lee, K.Y.3
  • 54
    • 36449002166 scopus 로고
    • Electromigration in Al(Cu) two-level structures: effect of Cu and kinetics of damage formation
    • C.-K. Hu, M.B. Small and P.S. Ho (1993) Electromigration in Al(Cu) two-level structures: effect of Cu and kinetics of damage formation. J. Appl. Phys. 74 969-978.
    • (1993) J. Appl. Phys. , vol.74 , pp. 969-978
    • Hu, C.-K.1    Small, M.B.2    Ho, P.S.3
  • 55
    • 0024626558 scopus 로고
    • The cracking and decohesion of thin films on ductile substrates
    • M.S. Hu and A.G. Evans (1989) The cracking and decohesion of thin films on ductile substrates. Acta Metall. 37 917-925.
    • (1989) Acta Metall. , vol.37 , pp. 917-925
    • Hu, M.S.1    Evans, A.G.2
  • 56
    • 0035801936 scopus 로고    scopus 로고
    • Metal film crawling in interconnect structures caused by cyclic temperatures
    • M. Huang, Z. Suo and Q. Ma (2001) Metal film crawling in interconnect structures caused by cyclic temperatures. Acta Mater. 49 3039-3049.
    • (2001) Acta Mater. , vol.49 , pp. 3039-3049
    • Huang, M.1    Suo, Z.2    Ma, Q.3
  • 57
    • 0036567892 scopus 로고    scopus 로고
    • Ratcheting induced cracks in thin film structures
    • M. Huang, Z. Suo and Q. Ma (2002) Ratcheting induced cracks in thin film structures. J. Mech. Phys. Solids 50 1079-1098.
    • (2002) J. Mech. Phys. Solids , vol.50 , pp. 1079-1098
    • Huang, M.1    Suo, Z.2    Ma, Q.3
  • 58
    • 0034211118 scopus 로고    scopus 로고
    • Thin film cracking and ratcheting caused by temperature cycling
    • M. Huang, Z. Suo, Q. Ma and H. Fujimoto (2000) Thin film cracking and ratcheting caused by temperature cycling. J. Mater. Res. 15 1239-1242.
    • (2000) J. Mater. Res. , vol.15 , pp. 1239-1242
    • Huang, M.1    Suo, Z.2    Ma, Q.3    Fujimoto, H.4
  • 59
    • 85146759478 scopus 로고    scopus 로고
    • R. Huang, J. H. Prévost, Z. Y. Huang and Z. Suo, 2003, Channel-cracking of thin films with the extended finite element method, submitted, Preprint is online at , Publication 138
    • R. Huang, J. H. Prévost, Z. Y. Huang and Z. Suo, 2003, Channel-cracking of thin films with the extended finite element method, submitted, Preprint is online at www.princeton.edu/∼SUO, Publication 138.
  • 60
    • 49749201891 scopus 로고
    • Current-induced marker motion in gold wires
    • H.B. Huntington and A.R. Grone (1961) Current-induced marker motion in gold wires. J. Phys. Chem. Solids 20 76-87.
    • (1961) J. Phys. Chem. Solids , vol.20 , pp. 76-87
    • Huntington, H.B.1    Grone, A.R.2
  • 61
    • 0033875372 scopus 로고    scopus 로고
    • Mechanics of materials: top-down approaches to fracture
    • J.W. Hutchinson and A.G. Evans (2000) Mechanics of materials: top-down approaches to fracture. Acta Mater. 48 125-135.
    • (2000) Acta Mater. , vol.48 , pp. 125-135
    • Hutchinson, J.W.1    Evans, A.G.2
  • 62
    • 71149121504 scopus 로고
    • Mixed-mode cracking in layered materials
    • J.W. Hutchinson and Z. Suo (1991) Mixed-mode cracking in layered materials. Adv. Appl. Mech. 29 63-191.
    • (1991) Adv. Appl. Mech. , vol.29 , pp. 63-191
    • Hutchinson, J.W.1    Suo, Z.2
  • 63
    • 0019279689 scopus 로고
    • Deformation of Al metallization in plastic encapsulated semiconductor devices caused by thermal shock
    • IEEE
    • M. Isagawa, Y. Iwasaki and T. Sutoh (1980) Deformation of Al metallization in plastic encapsulated semiconductor devices caused by thermal shock. Proc. Int. Reliability Phys. Symp. IEEE 171-177.
    • (1980) Proc. Int. Reliability Phys. Symp. , pp. 171-177
    • Isagawa, M.1    Iwasaki, Y.2    Sutoh, T.3
  • 64
    • 0000176750 scopus 로고
    • Mechanical-behavior of a continuous fiber-reinforced aluminum matrix composite subjected to transverse and thermal loading
    • S. Jansson and F.A. Leckie (1992) Mechanical-behavior of a continuous fiber-reinforced aluminum matrix composite subjected to transverse and thermal loading. J. Mech. Phys. Solids 40 593-612.
    • (1992) J. Mech. Phys. Solids , vol.40 , pp. 593-612
    • Jansson, S.1    Leckie, F.A.2
  • 65
    • 0001008867 scopus 로고
    • Stress analysis of encapsulated fine-line aluminum interconnect
    • R.E. Jones and M.L. Basehore (1987) Stress analysis of encapsulated fine-line aluminum interconnect. Appl. Phys. Lett. 50 725-727.
    • (1987) Appl. Phys. Lett. , vol.50 , pp. 725-727
    • Jones, R.E.1    Basehore, M.L.2
  • 66
    • 0035854080 scopus 로고    scopus 로고
    • A numerical model for the cyclic instability of thermally grown oxides in thermal barrier systems
    • A.M. Karlsson and A.G. Evans (2001) A numerical model for the cyclic instability of thermally grown oxides in thermal barrier systems. Acta Mater. 49 1793-1804.
    • (2001) Acta Mater. , vol.49 , pp. 1793-1804
    • Karlsson, A.M.1    Evans, A.G.2
  • 67
    • 0001491168 scopus 로고    scopus 로고
    • Local textures and grain boundaries in voided copper interconnects
    • R.R. Keller, J.A. Nucci and D.P. Field (1997) Local textures and grain boundaries in voided copper interconnects. J. Electron. Mater. 26 996-1001.
    • (1997) J. Electron. Mater. , vol.26 , pp. 996-1001
    • Keller, R.R.1    Nucci, J.A.2    Field, D.P.3
  • 68
    • 0036470469 scopus 로고    scopus 로고
    • Moisture-assisted subcritical debonding of a polymer/metal interface
    • S.-Y. Kook and R.H. Dauskardt (2002) Moisture-assisted subcritical debonding of a polymer/metal interface. J. Appl. Phys. 91 1293-1303.
    • (2002) J. Appl. Phys. , vol.91 , pp. 1293-1303
    • Kook, S.-Y.1    Dauskardt, R.H.2
  • 69
    • 36449009582 scopus 로고
    • Stress relaxation of passivated aluminum line metalizations on silicon substrate
    • M.A. Korhonen, R.D. Black and C.-Y. Li (1991) Stress relaxation of passivated aluminum line metalizations on silicon substrate. J. Appl. Phys. 69 1748-1755.
    • (1991) J. Appl. Phys. , vol.69 , pp. 1748-1755
    • Korhonen, M.A.1    Black, R.D.2    Li, C.-Y.3
  • 70
    • 0038035318 scopus 로고
    • Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses
    • M.A. Korhonen, P. Borgesen, K.N. Tu and C.-Y. Li (1993) Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses. J. Appl. Phys. 73 3790-5004.
    • (1993) J. Appl. Phys. , vol.73 , pp. 3790-5004
    • Korhonen, M.A.1    Borgesen, P.2    Tu, K.N.3    Li, C.-Y.4
  • 71
    • 0031117638 scopus 로고    scopus 로고
    • Electromigration mechanisms in conductor lines: void shape changes and slit-like failure
    • O. Kraft and E. Arzt (1997) Electromigration mechanisms in conductor lines: void shape changes and slit-like failure. Acta Mater. 45 1599-1611.
    • (1997) Acta Mater. , vol.45 , pp. 1599-1611
    • Kraft, O.1    Arzt, E.2
  • 72
    • 0033990021 scopus 로고    scopus 로고
    • Adhesion and reliability of copper interconnects with Ta and TaN barrier layers
    • M. Lane, R.H. Dauskardt, N. Krishna and I. Hashim (2000) Adhesion and reliability of copper interconnects with Ta and TaN barrier layers. J. Mater. Res. 15 203-211.
    • (2000) J. Mater. Res. , vol.15 , pp. 203-211
    • Lane, M.1    Dauskardt, R.H.2    Krishna, N.3    Hashim, I.4
  • 73
    • 0034582833 scopus 로고    scopus 로고
    • Plasticity contributions to interface adhesion in thin film interconnect structures
    • M. Lane, R.H. Dauskardt, A. Vainchtein and H. Gao (2000) Plasticity contributions to interface adhesion in thin film interconnect structures. J. Mater. Res. 15 2758-2769.
    • (2000) J. Mater. Res. , vol.15 , pp. 2758-2769
    • Lane, M.1    Dauskardt, R.H.2    Vainchtein, A.3    Gao, H.4
  • 77
    • 36449008541 scopus 로고
    • In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects
    • K.L. Lee, C.-K. Hu and K.N. Tu (1995) In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects. J. Appl. Phys. 78 4428-4437.
    • (1995) J. Appl. Phys. , vol.78 , pp. 4428-4437
    • Lee, K.L.1    Hu, C.-K.2    Tu, K.N.3
  • 78
    • 0021786489 scopus 로고
    • A comparison of methods for calculating energy release rates
    • F.Z. Li, C.F. Shih and A. Needleman (1985) A comparison of methods for calculating energy release rates. Eng. Fract. Mech. 21 405-421.
    • (1985) Eng. Fract. Mech. , vol.21 , pp. 405-421
    • Li, F.Z.1    Shih, C.F.2    Needleman, A.3
  • 80
    • 85146752638 scopus 로고    scopus 로고
    • Evolving crack patterns in thin films with the extended finite element method
    • in press
    • J. Liang, R. Huang, J. H. Prévost and Z. Suo, 2002b, Evolving crack patterns in thin films with the extended finite element method, Int. J. Solids Struct., in press.
    • (2002) Int. J. Solids Struct.
    • Liang, J.1    Huang, R.2    Prévost, J.H.3    Suo, Z.4
  • 81
    • 0026219801 scopus 로고
    • Biaxial loading experiments for determining interfacial fracture-toughness
    • K.M. Liechti and Y.S. Chai (1991) Biaxial loading experiments for determining interfacial fracture-toughness. J. Appl. Mech. 58 680-687.
    • (1991) J. Appl. Mech. , vol.58 , pp. 680-687
    • Liechti, K.M.1    Chai, Y.S.2
  • 82
    • 0037103690 scopus 로고    scopus 로고
    • In situ study of void growth kinetics in electroplated Cu lines
    • E. Liniger, L. Gignac, C.-K. Hu and S. Kaldor (2002) In situ study of void growth kinetics in electroplated Cu lines. J. Appl. Phys. 92 1803-1810.
    • (2002) J. Appl. Phys. , vol.92 , pp. 1803-1810
    • Liniger, E.1    Gignac, L.2    Hu, C.-K.3    Kaldor, S.4
  • 83
    • 0033937363 scopus 로고    scopus 로고
    • Cracking and debonding in integrated circuit structures
    • X.H. Liu, Z. Suo, Q. Ma and H. Fujimoto (2000) Cracking and debonding in integrated circuit structures. Eng. Fract. Mech. 66 387-402.
    • (2000) Eng. Fract. Mech. , vol.66 , pp. 387-402
    • Liu, X.H.1    Suo, Z.2    Ma, Q.3    Fujimoto, H.4
  • 84
    • 0026204409 scopus 로고
    • Matrix cracking in intermetallic composites caused by thermal expansion mismatch
    • T.C. Lu, J. Yang, Z. Suo, A.G. Evans, R. Hecht and R. Mehrabian (1991) Matrix cracking in intermetallic composites caused by thermal expansion mismatch. Acta Metall. Mater. 39 1883-1890.
    • (1991) Acta Metall. Mater. , vol.39 , pp. 1883-1890
    • Lu, T.C.1    Yang, J.2    Suo, Z.3    Evans, A.G.4    Hecht, R.5    Mehrabian, R.6
  • 85
    • 0000704120 scopus 로고
    • High resolution determination of the stress in individual interconnect lines and the variation due to electromigration
    • Q. Ma, S. Chiras, D.R. Clarke and Z. Suo (1995) High resolution determination of the stress in individual interconnect lines and the variation due to electromigration. J. Appl. Phys. 78 1614-1622.
    • (1995) J. Appl. Phys. , vol.78 , pp. 1614-1622
    • Ma, Q.1    Chiras, S.2    Clarke, D.R.3    Suo, Z.4
  • 86
    • 0032318497 scopus 로고    scopus 로고
    • Channel cracking technique for toughness measurement of brittle dielectric thin films on silicon substrates
    • Q. Ma, J. Xie, S. Chao, S. El-Mansy, R. McFadden and H. Fujimoto (1998) Channel cracking technique for toughness measurement of brittle dielectric thin films on silicon substrates. Mater. Res. Soc. Symp. Proc. 516 331-336.
    • (1998) Mater. Res. Soc. Symp. Proc. , vol.516 , pp. 331-336
    • Ma, Q.1    Xie, J.2    Chao, S.3    El-Mansy, S.4    McFadden, R.5    Fujimoto, H.6
  • 87
    • 0031257926 scopus 로고    scopus 로고
    • The influence of blunting on crack growth at oxide/metal interfaces
    • S.X. Mao and A.G. Evans (1997) The influence of blunting on crack growth at oxide/metal interfaces. Acta Mater. 45 4263-4270.
    • (1997) Acta Mater. , vol.45 , pp. 4263-4270
    • Mao, S.X.1    Evans, A.G.2
  • 88
    • 0000951860 scopus 로고
    • Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines
    • T. Marieb, P. Flinn, J.C. Bravman, D. Gardner and M. Madden (1995) Observations of electromigration induced void nucleation and growth in polycrystalline and near-bamboo passivated Al lines. J. Appl. Phys. 78 1026-1032.
    • (1995) J. Appl. Phys. , vol.78 , pp. 1026-1032
    • Marieb, T.1    Flinn, P.2    Bravman, J.C.3    Gardner, D.4    Madden, M.5
  • 89
    • 0034498614 scopus 로고    scopus 로고
    • Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect
    • S.J. Martin, J.P. Godschalx, M.E. Mills, E.O. Shaffer and P.H. Townsend (2000) Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect. Adv. Mater. 12 1769-1778.
    • (2000) Adv. Mater. , vol.12 , pp. 1769-1778
    • Martin, S.J.1    Godschalx, J.P.2    Mills, M.E.3    Shaffer, E.O.4    Townsend, P.H.5
  • 91
    • 0001163312 scopus 로고
    • A model for stress-induced notching and voiding in very large-scale integrated Al–Si (1%) metalization
    • J.W. McPherson and C.F. Dunn (1987) A model for stress-induced notching and voiding in very large-scale integrated Al–Si (1%) metalization. J. Vac. Sci. Technol. B5 1321-1325.
    • (1987) J. Vac. Sci. Technol. , vol.B5 , pp. 1321-1325
    • McPherson, J.W.1    Dunn, C.F.2
  • 92
    • 0033326202 scopus 로고    scopus 로고
    • Die cracking and reliable die design for flip-chip assemblies
    • S. Michaelides and S.K. Sitaraman (1999) Die cracking and reliable die design for flip-chip assemblies. IEEE Trans. Adv. Packag. 22(4), 602-613.
    • (1999) IEEE Trans. Adv. Packag. , vol.22 , Issue.4 , pp. 602-613
    • Michaelides, S.1    Sitaraman, S.K.2
  • 93
    • 0033349534 scopus 로고    scopus 로고
    • A finite element method for crack growth without remeshing
    • N. Moes, J. Dolbow and T. Belytschko (1999) A finite element method for crack growth without remeshing. Int. J. Num. Methods Eng. 46 131-150.
    • (1999) Int. J. Num. Methods Eng. , vol.46 , pp. 131-150
    • Moes, N.1    Dolbow, J.2    Belytschko, T.3
  • 95
    • 0035879717 scopus 로고    scopus 로고
    • Discrete dislocation and continuum descriptions of plastic flow
    • A. Needleman and E. Van der Giessen (2001) Discrete dislocation and continuum descriptions of plastic flow. Mater. Sci. Eng. A309 1-13.
    • (2001) Mater. Sci. Eng. , vol.A309 , pp. 1-13
    • Needleman, A.1    Van der Giessen, E.2
  • 96
    • 0024766321 scopus 로고
    • Mechanical-properties of thin-films
    • W.D. Nix (1989) Mechanical-properties of thin-films. Metall. Trans. 20A 2217-2245.
    • (1989) Metall. Trans. , vol.20A , pp. 2217-2245
    • Nix, W.D.1
  • 98
    • 0023602637 scopus 로고
    • Subcritical crack-growth along ceramic-metal interfaces
    • T.S. Oh, R.M. Cannon and R.O. Ritchie (1987) Subcritical crack-growth along ceramic-metal interfaces. J. Am. Ceram. Soc. 70 C352-C355.
    • (1987) J. Am. Ceram. Soc. , vol.70 , pp. C352-C355
    • Oh, T.S.1    Cannon, R.M.2    Ritchie, R.O.3
  • 99
    • 0027887532 scopus 로고
    • Stress-induced void formation in metallization for integrated circuits
    • H. Okabayashi (1993) Stress-induced void formation in metallization for integrated circuits. Mater. Sci. Eng. R11 191-241.
    • (1993) Mater. Sci. Eng. , vol.R11 , pp. 191-241
    • Okabayashi, H.1
  • 100
    • 0009209195 scopus 로고    scopus 로고
    • New York: Simon and Shuster
    • T.R. Reid (2001) The Chip New York: Simon and Shuster
    • (2001) The Chip
    • Reid, T.R.1
  • 101
    • 0026388522 scopus 로고
    • The fracture-resistance of a model metal ceramic interface
    • I.E. Reimanis, B.J. Dalgleish and A.G. Evans (1991) The fracture-resistance of a model metal ceramic interface. Acta Metall. Mater. 39 3133-3141.
    • (1991) Acta Metall. Mater. , vol.39 , pp. 3133-3141
    • Reimanis, I.E.1    Dalgleish, B.J.2    Evans, A.G.3
  • 102
    • 0023979063 scopus 로고
    • Elastic fracture mechanics concepts for interfacial cracks
    • J.R. Rice (1988) Elastic fracture mechanics concepts for interfacial cracks. J. Appl. Mech. 55 98-103.
    • (1988) J. Appl. Mech. , vol.55 , pp. 98-103
    • Rice, J.R.1
  • 103
    • 84903399470 scopus 로고    scopus 로고
    • Adhesion and debonding of low-k carbon-doped oxide films in multi-layer thin film structures.
    • submitted
    • J. E. Rim, F. Shi, D.-I. Lee, F. Ohta and R. H. Dauskardt, 2002, Adhesion and debonding of low-k carbon-doped oxide films in multi-layer thin film structures. J. Mater. Res., submitted.
    • (2002) J. Mater. Res.
    • Rim, J.E.1    Shi, F.2    Lee, D.-I.3    Ohta, F.4    Dauskardt, R.H.5
  • 104
    • 36449001427 scopus 로고
    • Fatal electromigration voids in narrow aluminum–copper interconnect
    • J.H. Rose (1992) Fatal electromigration voids in narrow aluminum–copper interconnect. Appl. Phys. Lett. 61 2170-2172.
    • (1992) Appl. Phys. Lett. , vol.61 , pp. 2170-2172
    • Rose, J.H.1
  • 106
    • 0004852018 scopus 로고
    • Slit morphology of electromigration induced open circuit failures in fine line conductors
    • J.E. Sanchez, L.T. McKnelly and J.W. Morris (1992) Slit morphology of electromigration induced open circuit failures in fine line conductors. J. Appl. Phys. 72 3201-3203.
    • (1992) J. Appl. Phys. , vol.72 , pp. 3201-3203
    • Sanchez, J.E.1    McKnelly, L.T.2    Morris, J.W.3
  • 107
    • 0026868335 scopus 로고
    • A study of stress-driven diffusive growth of voids in encapsulated interconnect lines
    • A.I. Sauter and W.D. Nix (1992) A study of stress-driven diffusive growth of voids in encapsulated interconnect lines. J. Mater. Res. 7 1133-1143.
    • (1992) J. Mater. Res. , vol.7 , pp. 1133-1143
    • Sauter, A.I.1    Nix, W.D.2
  • 108
    • 0038974363 scopus 로고    scopus 로고
    • Void formation by thermal stress concentration at twin interfaces in Cu thin films
    • A. Sekiguchi, J. Koike, S. Kamiya, M. Saka and K. Maruyama (2001) Void formation by thermal stress concentration at twin interfaces in Cu thin films. Appl. Phys. Lett. 79 1264-1266.
    • (2001) Appl. Phys. Lett. , vol.79 , pp. 1264-1266
    • Sekiguchi, A.1    Koike, J.2    Kamiya, S.3    Saka, M.4    Maruyama, K.5
  • 112
    • 0026173613 scopus 로고
    • Elastic–plastic analysis of cracks on bimaterial interfaces: 3. Large-scale yielding
    • C.F. Shih, R.J. Asaro and N.P. O'Dowd (1991) Elastic–plastic analysis of cracks on bimaterial interfaces: 3. Large-scale yielding. J. Appl. Mech. 58 450-463.
    • (1991) J. Appl. Mech. , vol.58 , pp. 450-463
    • Shih, C.F.1    Asaro, R.J.2    O'Dowd, N.P.3
  • 113
    • 0037165921 scopus 로고    scopus 로고
    • Subcritical debonding of polymer/silica interfaces under monotonic and cyclic fatigue loading
    • J.M. Snodgrass, D. Pantelidis, M.L. Jenkins, J.C. Bravman and R.H. Dauskardt (2002) Subcritical debonding of polymer/silica interfaces under monotonic and cyclic fatigue loading. Acta Mater. 50 2395-2411.
    • (2002) Acta Mater. , vol.50 , pp. 2395-2411
    • Snodgrass, J.M.1    Pantelidis, D.2    Jenkins, M.L.3    Bravman, J.C.4    Dauskardt, R.H.5
  • 114
    • 0041870366 scopus 로고    scopus 로고
    • Accelerated life testing (ALT) in microelectronics and photonics: its role, attributes, challenges, pitfalls, and interaction with qualification tests
    • E. Suhir (2002) Accelerated life testing (ALT) in microelectronics and photonics: its role, attributes, challenges, pitfalls, and interaction with qualification tests. J. Electron. Packag. 124 281-291.
    • (2002) J. Electron. Packag. , vol.124 , pp. 281-291
    • Suhir, E.1
  • 115
    • 0029697286 scopus 로고    scopus 로고
    • Stress-induced voiding in microelectron metallization: void growth models and refinements
    • T.D. Sullivan (1996) Stress-induced voiding in microelectron metallization: void growth models and refinements. Ann. Rev. Mater. Sci. 26 333-364.
    • (1996) Ann. Rev. Mater. Sci. , vol.26 , pp. 333-364
    • Sullivan, T.D.1
  • 116
    • 0004274342 scopus 로고    scopus 로고
    • 2nd edn., Cambridge: Cambridge University Press
    • S. Suresh (1998) Fatigue of Materials 2nd edn. Cambridge: Cambridge University Press
    • (1998) Fatigue of Materials
    • Suresh, S.1
  • 117
    • 0028546607 scopus 로고
    • Emergence of crack by mass transport in elastic crystals stressed at high temperatures
    • B. Sun, Z. Suo and A.G. Evans (1994) Emergence of crack by mass transport in elastic crystals stressed at high temperatures. J. Mech. Phys. Solids 42 1653-1677.
    • (1994) J. Mech. Phys. Solids , vol.42 , pp. 1653-1677
    • Sun, B.1    Suo, Z.2    Evans, A.G.3
  • 118
    • 0000594331 scopus 로고    scopus 로고
    • Stable state of interconnect under temperature change and electric current
    • Z. Suo (1998) Stable state of interconnect under temperature change and electric current. Acta Mater. 46 3725-3732.
    • (1998) Acta Mater. , vol.46 , pp. 3725-3732
    • Suo, Z.1
  • 119
    • 85146800938 scopus 로고    scopus 로고
    • Unpublished research
    • Z. Suo and J. He, 2002, Unpublished research.
    • (2002)
    • Suo, Z.1    He, J.2
  • 120
    • 0024301167 scopus 로고
    • Sandwich specimens for measuring interface crack toughness
    • Z. Suo and J.W. Hutchinson (1989) Sandwich specimens for measuring interface crack toughness. Mater. Sci. Eng. A107 135-143.
    • (1989) Mater. Sci. Eng. , vol.A107 , pp. 135-143
    • Suo, Z.1    Hutchinson, J.W.2
  • 121
    • 0025421834 scopus 로고
    • Interface crack between two elastic layers
    • Z. Suo and J.W. Hutchinson (1990) Interface crack between two elastic layers. Int. J. Fract. 43 1-18.
    • (1990) Int. J. Fract. , vol.43 , pp. 1-18
    • Suo, Z.1    Hutchinson, J.W.2
  • 122
    • 0344981301 scopus 로고    scopus 로고
    • Kinetics of crack initiation and growth in organic-containing integrated structures.
    • submitted
    • Z. Suo, J. H. Prévost and J. Liang, 2003, Kinetics of crack initiation and growth in organic-containing integrated structures. J. Mech. Phys. Solids, submitted.
    • (2003) J. Mech. Phys. Solids
    • Suo, Z.1    Prévost, J.H.2    Liang, J.3
  • 123
    • 0027588623 scopus 로고
    • A theory for cleavage cracking in the presence of plastic flow
    • Z. Suo, C.F. Shih and A.G. Varias (1993) A theory for cleavage cracking in the presence of plastic flow. Acta Metall. Mater. 41 1551-1557.
    • (1993) Acta Metall. Mater. , vol.41 , pp. 1551-1557
    • Suo, Z.1    Shih, C.F.2    Varias, A.G.3
  • 125
    • 0022313453 scopus 로고
    • Stress-induced deformation of aluminum metallization in plastic molded semiconductor-devices
    • R.E. Thomas (1985) Stress-induced deformation of aluminum metallization in plastic molded semiconductor-devices. IEEE Trans. Compon. Hybrids Manuf. Technol. 8 427-434.
    • (1985) IEEE Trans. Compon. Hybrids Manuf. Technol. , vol.8 , pp. 427-434
    • Thomas, R.E.1
  • 126
    • 84953680759 scopus 로고
    • Cracking and delamination of coatings
    • M.D. Thouless (1991) Cracking and delamination of coatings. J. Vac. Sci. Technol. A9 2510-2515.
    • (1991) J. Vac. Sci. Technol. , vol.A9 , pp. 2510-2515
    • Thouless, M.D.1
  • 128
    • 0012726108 scopus 로고    scopus 로고
    • Damage nucleation during electromigration along an isolated interface in an elastic medium
    • M.D. Thouless, H.H. Yu, Z.J. Zhao and W. Yang (1996) Damage nucleation during electromigration along an isolated interface in an elastic medium. J. Mech. Phys. Solids 44 371-387.
    • (1996) J. Mech. Phys. Solids , vol.44 , pp. 371-387
    • Thouless, M.D.1    Yu, H.H.2    Zhao, Z.J.3    Yang, W.4
  • 131
    • 0000323896 scopus 로고
    • Linewidth dependence of electromigration in evaporated Al–0.5%Cu
    • S. Vaidya, T.T. Sheng and A.K. Sinha (1980) Linewidth dependence of electromigration in evaporated Al–0.5%Cu. Appl. Phys. Lett. 36 464-466.
    • (1980) Appl. Phys. Lett. , vol.36 , pp. 464-466
    • Vaidya, S.1    Sheng, T.T.2    Sinha, A.K.3
  • 132
    • 0000344306 scopus 로고
    • Ductile failure of a constrained metal foil
    • A.G. Varias, Z. Suo and C.F. Shih (1991) Ductile failure of a constrained metal foil. J. Mech. Phys. Solids 39 963-986.
    • (1991) J. Mech. Phys. Solids , vol.39 , pp. 963-986
    • Varias, A.G.1    Suo, Z.2    Shih, C.F.3
  • 133
    • 0036146193 scopus 로고    scopus 로고
    • Mechanical Properties in Small Dimensions.
    • R. P. Vinci and S. P. Baker (eds.)
    • R. P. Vinci and S. P. Baker (eds.), 2002, Mechanical Properties in Small Dimensions. MRS Bull., 27, 12–53.
    • (2002) MRS Bull. , vol.27 , pp. 12-53
  • 134
    • 0037039675 scopus 로고    scopus 로고
    • Interfacial toughness measurements for thin films on substrates
    • A.A. Volinsky, N.R. Moody and W.W. Gerberich (2002) Interfacial toughness measurements for thin films on substrates. Acta Mater. 50 441-466.
    • (2002) Acta Mater. , vol.50 , pp. 441-466
    • Volinsky, A.A.1    Moody, N.R.2    Gerberich, W.W.3
  • 135
    • 0025461953 scopus 로고
    • Experimental determination of interfacial toughness curves using Brazil-nut-sandwiches
    • J.S. Wang and Z. Suo (1990) Experimental determination of interfacial toughness curves using Brazil-nut-sandwiches. Acta Metall. 38 1279-1290.
    • (1990) Acta Metall. , vol.38 , pp. 1279-1290
    • Wang, J.S.1    Suo, Z.2
  • 136
    • 0001127312 scopus 로고    scopus 로고
    • Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
    • P.-C. Wang, G.S. Cargill, I.C. Noyan and C.-K. Hu (1998) Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction. Appl. Phys. Lett. 72 1296-1298.
    • (1998) Appl. Phys. Lett. , vol.72 , pp. 1296-1298
    • Wang, P.-C.1    Cargill, G.S.2    Noyan, I.C.3    Hu, C.-K.4
  • 137
    • 0035806047 scopus 로고    scopus 로고
    • Electromigration threshold in copper interconnects
    • P.-C. Wang and R.G. Filippi (2001) Electromigration threshold in copper interconnects. Appl. Phys. Lett. 78 3598-3600.
    • (2001) Appl. Phys. Lett. , vol.78 , pp. 3598-3600
    • Wang, P.-C.1    Filippi, R.G.2
  • 138
    • 0000362877 scopus 로고    scopus 로고
    • A simulation of electromigration-induced transgranular slits
    • W. Wang, Z. Suo and T.-H. Hao (1996) A simulation of electromigration-induced transgranular slits. J. Appl. Phys. 79 2394-2403.
    • (1996) J. Appl. Phys. , vol.79 , pp. 2394-2403
    • Wang, W.1    Suo, Z.2    Hao, T.-H.3
  • 139
    • 0001036992 scopus 로고
    • The stress around a fault or crack in dissimilar media
    • M.L. Williams (1959) The stress around a fault or crack in dissimilar media. Bull. Seismological Soc. Am. 49 199-204.
    • (1959) Bull. Seismological Soc. Am. , vol.49 , pp. 199-204
    • Williams, M.L.1
  • 140
    • 0032094788 scopus 로고    scopus 로고
    • Two test specimens for determining the interfacial fracture toughness in flip-chip assemblies
    • X. Yan and R.K. Agarwal (1998) Two test specimens for determining the interfacial fracture toughness in flip-chip assemblies. ASME Trans. J. Electron. Packag. 120 150-155.
    • (1998) ASME Trans. J. Electron. Packag. , vol.120 , pp. 150-155
    • Yan, X.1    Agarwal, R.K.2
  • 141
    • 0027045651 scopus 로고
    • Thin film cracking and the roles of substrate and interface
    • T. Ye, Z. Suo and A.G. Evans (1992) Thin film cracking and the roles of substrate and interface. Int. J. Solids Struct. 29 2639-2648.
    • (1992) Int. J. Solids Struct. , vol.29 , pp. 2639-2648
    • Ye, T.1    Suo, Z.2    Evans, A.G.3
  • 142
    • 0035151265 scopus 로고    scopus 로고
    • Edge effects in thin film delamination
    • H.H. Yu, M.Y. He and J.W. Hutchinson (2001) Edge effects in thin film delamination. Acta Mater. 49 93-107.
    • (2001) Acta Mater. , vol.49 , pp. 93-107
    • Yu, H.H.1    He, M.Y.2    Hutchinson, J.W.3
  • 145
    • 0032715263 scopus 로고    scopus 로고
    • Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
    • Y.W. Zhang, A.F. Bower, L. Xia and C.F. Shih (1999) Three dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion. J. Mech. Phys. Solids 47 173-199.
    • (1999) J. Mech. Phys. Solids , vol.47 , pp. 173-199
    • Zhang, Y.W.1    Bower, A.F.2    Xia, L.3    Shih, C.F.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.