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Journal of Materials Research

Volumn 15, Issue 6, 2000, Pages 1239-1242

Thin film cracking and ratcheting caused by temperature cycling

(4) Huang, M a Suo, Z a Ma, Q b Fujimoto, H b

a Princeton University (United States)

b INTEL CORPORATION (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; CRACK INITIATION; DIES; DUCTILITY; SHEAR STRESS; STRESS RELAXATION; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION;

RATCHETING;

THIN FILMS;

EID: 0034211118 PISSN: 08842914 EISSN: None Source Type: Journal
DOI: 10.1557/JMR.2000.0177 Document Type: Article

Times cited : (63)

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