Crack patterns in thin films

Journal of the Mechanics and Physics of Solids

Volumn 48, Issue 6, 2000, Pages 1107-1131

  Xia, Z Cedric ^a   Hutchinson, John W ^b  

^a FORD RESEARCH LABORATORY   (United States)

^b HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELASTICITY; INTEGRAL EQUATIONS; MATHEMATICAL MODELS; RESIDUAL STRESSES; SUBSTRATES; TENSILE STRESS; TENSILE TESTING; THIN FILMS;

CRACK PATTERNS; ELASTIC FILMS;

CRACK PROPAGATION;

EID: 0033879864     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-5096(99)00081-2     Document Type: Article

References (21)

1. Argon A.S. Surface cracks on glass. Proc. Roy. Soc. A250:1959;472-481.
2. Beuth J.L. Cracking of thin bonded films in residual tension. Int. J. Solids Structures. 29:1992;1657-1675.
3. Beuth J.L., Klingbeil N.W. Cracking of thin films bonded to elastic-plastic substrates. J. Mech. Phys. Solids. 44:1996;1411-1428.
4. Broberg K.B. On crack paths. Engng. Fracture Mech. 28:1987;663-679.
5. Chen S.-Y., Chen I.-W. Cracking during pyrolysis of oxide thin films-phenomenology, mechanisms and mechanics. J. Am. Ceram. Soc. 78:1995;2929-2939.
6. Cotterell B., Rice J.R. Slightly curved or kinked cracks. Int. J. Fracture. 16:1980;155-169.
7. Delannay F., Warren P. On crack interaction and crack density in strain-induced cracking of brittle films on ductile substrates. Acta Metall. Mater. 39:1991;1061-1072.
8. Dillard D.A., Hinkley J.A., Johnson W.S., St.Clair T.L. Spiral tunneling cracks induced by environmental stress cracking in LARC-TPI adhesives. J. Adhesion. 44:1994;51-67.
9. Erdogan, F., Gupta, G.D., 1972. On the numerical solution of singular integral equations. Q. Appl. Math., 523-534.
10. Garino T.J. The cracking of sol-gel films during drying. Mat. Res. Soc. Symp. Proc., Materials Research Society, vol. 180 :1990;497-502.
11. Hu M.S., Evans A.G. The cracking and decohesion of thin films on ductile substrates. Acta Metall. 37:1989;917-925.
12. Hutchinson J.W., Suo Z. Mixed mode cracking in layered materials. Adv. Appl. Mech. 29:1992;63-191.
13. Kaya A.C., Erdogan F. On the solution of integral equations with strongly singular kernels. Q. Appl. Math. 45:1987;105-122.
14. Kaw A.K. On evaluating integrals with strongly singular integrands. Adv. Eng. Software. 13:1991;84-101.
15. Melin S. Why do cracks avoid each other? Int. J. Fracture. 23:1983;37-45.
16. Nakamura T., Kamath S. Three-dimensional effects in thin film fracture. Mech. Materials. 13:1992;67-77.
17. Rice J.R. Mathematical analysis in the mechanics of fracture. Leibowitz H. Fracture. vol. 2:1968;191-311 Academic Press, New York.
18. Tada H., Paris P.C., Irwin G.R. The Stress Analysis of Cracks Handbook. 1985;Del Research Corp, St Louis, MO.
19. Thouless M.D., Olsson E., Gupta A. Cracking of brittle films on elastic substrates. Acta Metall. Mater. 40:1992;1287-1292.
20. Ye T., Suo Z., Evans A.G. Thin film cracking and the role of substrate and interface. Int. J. Solids Structures. 29:1992;2639-2648.
21. Willis J.R., Nemat-Nasser S. Singular perturbation solution of a class of singular integral equations. Q. Appl. Math. 48:1991;741-753.