A thermo-mechanical approach for fatigue testing of polymer bimaterial interfaces

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 4, 1998, Pages 372-378

  Gurumurthy, C K ^a   Jiao, J ^a   Norris, L G ^a   Hui, C Y ^b   Kramer, E J ^c  

^a Cornell University   (United States)

^b Department of Obstetrics Gynecology   (United States)

^c University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DELAMINATION; FATIGUE TESTING; FLIP CHIP DEVICES; INTERFACES (MATERIALS); PASSIVATION; PLASTIC COATINGS; POLYIMIDES; PROTECTIVE COATINGS; STRAIN RATE; THERMAL CYCLING; THERMAL STRESS;

DIRECT CHIP ATTACH (DCA) ASSEMBLIES; UNDERFILLS;

ELECTRONICS PACKAGING;

EID: 0032294955     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792649     Document Type: Article

References (15)

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