Copper metallization for high performance silicon technology

Annual Review of Materials Science

Volumn 30, Issue , 2000, Pages 229-262

  Rosenberg, R ^a   Edelstein, D C ^a   Hu, C K ^a   Rodbell, K P ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; ELECTROMIGRATION; ELECTROPLATING; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; MICROPROCESSOR CHIPS; MICROSTRUCTURE; RELIABILITY;

COPPER INTERCONNECTS; ELECTROMIGRATION RESISTANCE;

COPPER PLATING;

EID: 0033709195     PISSN: 00846600     EISSN: None     Source Type: Journal    
DOI: 10.1146/annurev.matsci.30.1.229     Document Type: Article

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