Two test specimens for determining the interfacial fracture toughness in flip-chip assemblies

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 2, 1998, Pages 150-156

  Yan, X ^a   Agarwal, R K ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FRACTURE MECHANICS; FRACTURE TOUGHNESS; INTEGRATED CIRCUIT TESTING; INTERFACES (MATERIALS); MATHEMATICAL MODELS;

FOUR POINT BEND LOADING;

FLIP CHIP DEVICES;

EID: 0032094788     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792607     Document Type: Article

References (14)

1. Cao, H. C., and Evans, A. G., 1989, “An Experimental Study of the Fracture Resistance of Bimaterial Interfaces,”Mechanics of Material, Vol. 7, pp. 295-304.
2. Charralambides, P. G., Lund, A. G., Evans, A. G., McMeeking, R. M., 1989, “A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces,”ASME J. Of Appl. Mech., Vol. 56, pp. 77-82.
3. Evans, A. G. and Hutchinson, J. W., 1995, “The Thermomechanical Integrity of Thin Films and Multilayers,”Acta Metall. Mater., Vol. 43, No. 7, pp. 2507-2530.
4. Liu, S., Mei, Y. H., and Wu, T. Y., 1994, “Bimaterial Interfacial Crack Growth as a Function of Mode-Mixity in Resin/Copper Interface,” ASME AMD-Vol. 187, pp. 101-111.
5. O’Dowd, N. P., Shih, C. F., and Stout, M. G., 1992, “Test Geometries for Measuring Interfacial Fracture Toughness,”Int. J. Of Solids and Structures, Vol. 29, pp. 571.
6. Rice, J., 1968, “A Path-Independent Integral and the Approximate Analysis of Strain Concentration by Notches and Cracks,”ASMEJ. Of Appl. Mech., Vol. 35, pp. 379-386.
7. Rice, J. R., 1988, “Elastic Fracture Mechanics Concepts for Interfacial Cracks,”ASMEJ. Of Appl. Mech., Vol. 55, pp. 98-103.
8. Rice, J. R., Suo Z., and Wang, J. S., 1989, “Mechanics and Thermodynamics of Brittle Interfacial Failure in Bimaterial Systems,” Proceedings of an International Workshop on Interfaces, Santa Barbara, CA, pp. 269-287.
9. Suo, Z., 1990, “Delamination Specimens for Orthotropic Materials,”ASME J. Of Appl. Mech., Vol. 57, pp. 627-634.
10. Suo, Z., and Hutchinson, B. W., 1989, “Sandwich Test Specimens for Measuring Interface Crack Toughness,” Mater. Sci. Engng., A 107, pp. 135-143.
11. Williams, M. L., 1959, “The Stress Around a Fault or Crack in Dissimilar Media,”Bulletin of the Seismological Society of America, Vol. 49, pp. 199-204.
12. Xiao, F., Hui, C.-Y., and Kramer, E. J., 1993, “Analysis of a Mixed Mode Fracture Specimen: the Asymmetric Double Cantilever Beam,”J. Material Science, Vol. 28, pp. 5620-5629.
13. Yan, X. T. and Agarwal, R., 1997, “Characterization of Interfaces in Flip-Chip Assemblies,” submitted for publication.
14. Yan, X. T., and Chiang, F. P., 1995, “Characterization of Interfacial Behavior in Bimaterials Using Toughness Curves,” ASME AMD-Vol. 211, pp. 159-173.