Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect

Advanced Materials

Volumn 12, Issue 23, 2000, Pages 1769-1778

  Martin, Steven J ^a   Godschalx, James P ^a   Mills, Michael E ^a   Shaffer II, Edward O ^a   Townsend, Paul H ^a  

^a DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSLINKING; CURING; DIELECTRIC MATERIALS; DIELECTRIC PROPERTIES OF SOLIDS; FRACTURE TOUGHNESS; INTEGRATED CIRCUIT MANUFACTURE; MOLECULAR WEIGHT; OPTICAL PROPERTIES; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TENSILE PROPERTIES; THERMODYNAMIC STABILITY;

COPPER DRIFT; INTEGRATED CIRCUIT INTERCONNECT; LOW DIELECTRIC CONSTANT POLYMER; LOW MOLECULAR WEIGHT AROMATIC THERMOSETTING POLYMER; SEMICONDUCTOR DIELECTRIC;

THERMOSETS;

EID: 0034498614     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/1521-4095(200012)12:23<1769::AID-ADMA1769>3.0.CO;2-5     Document Type: Article

References (31)

1. M. T. Bohr, in Proc. 1995 IEEE Int. Electron. Device Mtg., Washington, DC, December 10-13, 1995, pp. 241-242.
2. M. T. Bohr, in Advanced Metallization and Interconnect Systems for ULSI Applications (Eds: R. Havemann, J. Schmitz, H. Komiyama, K. Tsubouchi), Materials Research Society, Pittsburgh, PA 1996, pp. 3-10.
3. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, CA 1994.
4. R. A. Kirchhoff, K. J. Bruza, Prog. Polym. Sci. 1993, 18, 85.
5. S. Bothra, M. Kellam, P. Garrou, J. Electron. Mater. 1994, 23, 819.
6. Y. Hayashi, T. Onodera, S. Saitoh, J. Kawahara, Proc. Multilevel Interconnect Technol. 1998, 3508, 30.
7. H. Gundlach, A. Knorr, S. Nijsten, K. Kumar, Z. Bian, R. Talevi, E. O. Shaffer, A. E. Kaloyeros, R. E. Geer, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, June 1-3, 1998, p. 277-279.
8. P. H. Townsend, S. J. Martin, J. Godschalx, D. R. Romer, D. W. Smith, Jr., D. Castillo, R. DeVries, G. Buske, N. Rondan, S. Froelicher, J. Marshall, E. O. Shaffer, J.-H. Im, Mater. Res. Soc. Symp. Proc. 1997, 476, 9.
9. R. D. Goldblatt, B. Agarwala, M. B. Anand, E. P. Barth, G. A. Biery, Z. G. Chen, S. Cohen, J. B. Connolly, A. Cowley, T. Dalton, S. K. Das, C. R. Davis, A. Deutsch, C. DeWan, D. C. Edelstein, P. A. Emmi, C. G. Faltermeier, J. A. Fitzsimmons, J. Hedrick, J. E. Heindenreich, C. K. Hu, J. P. Hummel, P. Jones, E. Kaltalioglu, B. E. Kastenmeier, M. Krishnan, W. F. Landers, E. Liniger, J. Liu, N. E. Lustig, S. Malhotra, D. K. Manger, V. McGahay, R. Mih, H. A. Nye, S. Purushotharnan, H. A. Rathore, S. C. Seo, T. M. Shaw, A. H. Simon, T. A. Spooner, M. Stetter, R. A. Wachnik, J. G. Ryan, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, June 5-7, 2000, p. 261-263.
10. D. A. Babb, D. W. Smith, Jr., S. J. Martin, J. P. Godschalx, PCT Int. Appl. WO 97-10 193, 1997.
11. C.-I. Lang, G.-R. Yang, J. A. Moore, T.-M. Lu, Mater. Res. Soc. Symp. Proc. 1995, 381, 45.
12. J. P. Godschalx, D. R. Romer, Y. H. So, Z. Lysenko, M. E. Mills, G. R. Buske, P. H. Townsend III, D. W. Smith, Jr., S. J. Martin, R. A. DeVries, US Patent 5 965 679, 1999.
13. M. Kreyenschmidt, F. Uckert, K. Mullen, Macromolecules 1995, 28, 4577.
14. Private communication from T. M. Stokich, 2000.
15. A. L. S. Loke, S. S. Wong, N. A. Talwalkar, J. T. Wetzel, P. H. Townsend, T. Tanabe, R. N. Vrtis, M. P. Zussman, D. Kumar, Mater. Res. Soc. Proc. 1999, 565, 173.
16. J. Im, E. O. Shaffer II, T. Stokich, Jr., A. Strandjord, J. Hetzner, J. Curphy, C. Karas, G. Meyers, D. Hawn, A. Chakrabarti, S. Froelicher, ASME J. of Electron. Packaging 2000, 122, 28.
17. E. O. Shaffer II, F. J. McGarry, L. Hoang, Polym. Sci. Eng. 1996, 36, 2381.
18. E. O. Shaffer II, K. E. Howard, P. H. Townsend, M. E. Mills, Mater. Res. Soc. Symp. Proc., in press.
19. S. Allada, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, May 24-26, 1999, pp. 161-163.
20. I. Morey, A. Asthana, Solid State Technol. 1999, 42-6, 71.
21. G. Rajagopalan, A. Taylor, C. Foster, S. Bass, I. Morey, J. Flanner, S. Ellingboe, Proc. Electrochem. Soc. 1999, PV 99-30, 308.
22. M. Baklanov, S. Vanhaelemeersch, C. Alaerts, K. Maex, Mater. Res. Soc. Proc. 1998, 511, 247.
23. H. Maynard, C. S. Pai, C. B. Case, R. O. Adebanjo, M. R. Baker, W. Wai Tai, R. Liu, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, May 24-26, 1999, pp. 212-214.
24. S. Sankaran, W. Harris, G. Nuesca, E. O. Shaffer, S. J. Martin, R. E. Geer, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, June 5-7, 2000, pp. 40-42.
25. F. Kuchenmeister, U. Schubert, J. Heeg, C. Wenzel, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, May 24-26, 1999, pp. 158-160.
26. R. J. Gutmann, C. L. Borst, B.-C. Lee, D. Thakurta, D. Duquette, W. N. Gill, in Proc. 17th VLSI Multilevel Interconnect Conf., Santa Clara, CA, June 27-29, 2000, pp. 123-132.
27. J. Waeterloos, M. Simmonds, A. Achen, M. Meier, Semicond. Eur. 1999, August, 26.
28. S. Lee, M. Chae, H. Kim, T. Kim, S. Kim, C. T. Kim, J. M. Hwang, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, June 5-7, 2000, pp. 137-139.
29. M. Ikeda, H. Kudo, R. Shinohara, F. Shimpuku, M. Yamada, Y. Furumura, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, June 1-3, 1998, pp. 131-133.
30. R. A. Donaton, B. Coenegrachts, K. Maex, H. Struyf, S. Vanhaelemeersch, G. Beyer, E. Richard, I. Vervoort, W. Fyen, J. Grillaert, S. van der Groen, M. Stucchi, D. De Roest, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, May 24-26, 1999, pp. 262-264.
31. O. Demolliens, P. Berruyer, Y. Morand, C. Tabone, A. Roman, M. Cochet, M. Assous, H. Feldis, R. Blanc, E. Tabouret, D. Louis, C. Arvet, E. Lajoinic, Y. Gobil, G. Passemard, F. Jourdan, M. Moussavi, M. Cordeau, T. Morel, T. Mourier, L. Ulmer, E. Sicurani, F. Tardif, A. Beverina, Y. Trouillet, D. Renaud, in Proc. Int. Interconnect Tech. Conf., San Francisco, CA, May 24-26, 1999, pp. 198-199.